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Extract from the Register of European Patents

EP About this file: EP0690490

EP0690490 - Method of making a flip chip using electrically conductive polymers and dielectrics [Right-click to bookmark this link]
Former [1996/01]Flip chip technology using electrically conductive polymers and dielectrics
[2000/34]
StatusNo opposition filed within time limit
Status updated on  09.08.2002
Database last updated on 13.09.2024
Most recent event   Tooltip22.04.2005Lapse of the patent in a contracting state
New state(s): LU		published on 08.06.2005  [2005/23]
Applicant(s)For all designated states
PFC Corporation
14 Fortune Drive
Billerica, MA 01821 / US
[1998/13]
Former [1996/01]For all designated states
EPOXY TECHNOLOGY, INC.
14 Fortune Drive P.O. Box 567
Billerica Massachusetts 01821 / US
Inventor(s)01 / Estes, Richard H.
15 Blackstone Circle
Pelham, NH 03076 / US
02 / Kulesza, Frank W.
3 Grant Road
Winchester, MA 01890 / US
[1996/01]
Representative(s)Hess, Peter K. G., et al
Bardehle Pagenberg Partnerschaft mbB
Patentanwälte, Rechtsanwälte
Postfach 86 06 20
81633 München / DE
[N/P]
Former [2000/03]Hess, Peter K., Dipl.-Phys., et al
Bardehle,Pagenberg,Dost,Altenburg,Geissler,Isenbruck Patent- und Rechtsanwälte Postfach 86 06 20
81633 München / DE
Former [1996/01]Frohwitter, Bernhard, Dipl.-Ing., et al
Patent- und Rechtsanwälte Bardehle . Pagenberg . Dost . Altenburg . Frohwitter . Geissler & Partner Postfach 86 06 20
D-81633 München / DE
Application number, filing date95114886.518.12.1990
[1996/01]
Priority number, dateUS1989045219118.12.1989         Original published format: US 452191
[1996/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0690490
Date:03.01.1996
Language:EN
[1996/01]
Type: A3 Search report 
No.:EP0690490
Date:26.02.1997
[1997/09]
Type: B1 Patent specification 
No.:EP0690490
Date:04.10.2001
Language:EN
[2001/40]
Search report(s)(Supplementary) European search report - dispatched on:EP07.01.1997
ClassificationIPC:H01L21/60, H01L23/485, H01L23/532
[1997/08]
CPC:
H01L23/3171 (EP,US); H01L21/4853 (EP,US); H01L21/4867 (EP,US);
H01L21/563 (EP,US); H01L21/60 (KR); H01L23/4828 (EP,US);
H01L23/485 (KR); H01L23/5328 (EP,US); H01L24/11 (EP,US);
H01L24/12 (US); H01L24/16 (EP,US); H01L24/29 (EP,US);
H01L24/81 (EP,US); H01L24/83 (EP,US); H01L2224/1147 (EP,US);
H01L2224/13099 (EP,US); H01L2224/1319 (EP,US); H01L2224/29101 (EP,US);
H01L2224/2919 (EP,US); H01L2224/73203 (EP,US); H01L2224/81801 (EP,US);
H01L2224/8319 (EP,US); H01L2224/83856 (EP,US); H01L24/03 (EP);
H01L24/05 (EP); H01L24/13 (EP); H01L2924/00013 (EP,US);
H01L2924/01004 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01022 (EP,US); H01L2924/01032 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01047 (EP,US); H01L2924/01052 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/014 (EP,US);
H01L2924/0665 (EP,US); H01L2924/0781 (EP,US); H01L2924/10329 (EP,US);
H01L2924/12044 (EP,US); H01L2924/14 (EP,US); H01L2924/351 (EP,US);
H05K2201/10674 (EP,US); H05K2201/10977 (EP,US); H05K2203/1189 (EP,US);
H05K3/305 (EP,US); Y10T156/1092 (EP,US); Y10T29/49126 (EP,US);
Y10T29/49128 (EP,US); Y10T29/4913 (EP,US); Y10T29/49147 (EP,US) (-)
C-Set:
H01L2224/29101, H01L2924/014, H01L2924/00 (US,EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (US,EP);
H01L2924/00013, H01L2224/29099 (US,EP);
H01L2924/0665, H01L2924/00 (EP,US);
H01L2924/351, H01L2924/00 (EP,US)
(-)
Former IPC [1996/01]H01L21/60
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1996/01]
TitleGerman:Verfahren zur Herstellung eines Flip-Chips, wobei elektrisch leitende Polymere und Dielektrika angewendet werden[2000/34]
English:Method of making a flip chip using electrically conductive polymers and dielectrics[2000/34]
French:Procédé de fabrication d'un "Flip Chip" utilisant des polymères électroconductifs et des diélectriques[2000/34]
Former [1996/01]Flip-Chip-Technologie, wobei elektrisch leitende Polymere und Dielektrika angewendet werden
Former [1996/01]Flip chip technology using electrically conductive polymers and dielectrics
Former [1996/01]Technologie "Flip Chip" utilisant des polymères électroconductifs et des diélectriques
Examination procedure21.09.1995Examination requested  [1996/01]
21.11.1996Request for accelerated examination filed
22.08.1997Despatch of a communication from the examining division (Time limit: M06)
22.08.1997Decision about request for accelerated examination - accepted: Yes
11.02.1998Reply to a communication from the examining division
07.05.1998Despatch of a communication from the examining division (Time limit: M06)
17.11.1998Reply to a communication from the examining division
05.02.1999Despatch of a communication from the examining division (Time limit: M04)
13.07.1999Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
23.09.1999Reply to a communication from the examining division
04.02.2000Despatch of a communication from the examining division (Time limit: M02)
04.04.2000Reply to a communication from the examining division
02.08.2000Despatch of communication of intention to grant (Approval: Yes)
13.02.2001Communication of intention to grant the patent
23.05.2001Fee for grant paid
23.05.2001Fee for publishing/printing paid
Parent application(s)   TooltipEP91902599.9  / EP0506859
Divisional application(s)EP00126587.5  / EP1089331
Opposition(s)05.07.2002No opposition filed within time limit [2002/39]
Request for further processing for:23.09.1999Request for further processing filed
24.09.1999Full payment received (date of receipt of payment)
Request granted
14.10.1999Decision despatched
Fees paidRenewal fee
21.09.1995Renewal fee patent year 03
21.09.1995Renewal fee patent year 04
21.09.1995Renewal fee patent year 05
25.01.1996Renewal fee patent year 06
27.12.1996Renewal fee patent year 07
23.12.1997Renewal fee patent year 08
21.12.1998Renewal fee patent year 09
06.12.1999Renewal fee patent year 10
07.12.2000Renewal fee patent year 11
Penalty fee
Additional fee for renewal fee
01.01.199606   M06   Fee paid on   25.01.1996
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT04.10.2001
BE04.10.2001
GR04.10.2001
NL04.10.2001
LU18.12.2001
DK04.01.2002
SE04.01.2002
ES30.04.2002
[2005/23]
Former [2004/07]AT04.10.2001
BE04.10.2001
GR04.10.2001
NL04.10.2001
DK04.01.2002
SE04.01.2002
ES30.04.2002
Former [2004/04]AT04.10.2001
BE04.10.2001
NL04.10.2001
DK04.01.2002
SE04.01.2002
ES30.04.2002
Former [2003/45]AT04.10.2001
BE04.10.2001
NL04.10.2001
DK04.01.2002
SE04.01.2002
Former [2003/09]AT04.10.2001
BE04.10.2001
NL04.10.2001
SE04.01.2002
Former [2003/06]BE04.10.2001
NL04.10.2001
SE04.01.2002
Former [2002/26]SE04.01.2002
Documents cited:Search[A]JPS62104142  ;
 [XA]DE3702354  (MITSUBISHI ELECTRIC CORP [JP]) [X] 1 * claims 1,5,6 * [A] 2,3,17-19;
 [A]EP0299894  (SGS THOMSON MICROELECTRONICS [FR]) [A] 1 * column 4, line 44 - line 48; claims 1,3 *;
 [A]US4840302  (GARDNER DAVID A [US], et al) [A] 1,2,6* figure 1; claims 1,4 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19871012), vol. 011, no. 312, Database accession no. (E - 548), & JP62104142 A 19870514 (NEC CORP) [A] 1,18 * abstract *
ExaminationWO9109419
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.