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EP0709887
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EP About this file: EP0709887
| EP0709887 - An interconnect structure using Al2Cu for an integrated circuit chip [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 20.11.1998 Database last updated on 02.09.2024 | Most recent event Tooltip | 20.11.1998 | Application deemed to be withdrawn | published on 07.01.1999 [1999/01] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1996/18] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Colgan, Evan George 138 Doxbury Lane Suffern, New York 10901 / US | 02 /
Rodbell, Kenneth Parker 3 Leo Lane Poughquag, New York 12570 / US | 03 /
Totta, Paul Anthony 29 Sandi Drive Poughkeepsie, New York 12603 / US | 04 /
White, James Francis 17 Lake View Drive Newburgh, New York 12508 / US | [1996/18] | Representative(s) | Teufel, Fritz, et al IBM Deutschland Management & Business Support GmbH Patentwesen u. Urheberrecht 71137 Ehningen / DE | [N/P] |
| Former [1997/24] | Teufel, Fritz, Dipl.-Phys., et al IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht 70548 Stuttgart / DE | ||
| Former [1996/18] | Lindner-Vogt, Karin, Dipl.-Phys. IBM Deutschland, Informationssysteme GmbH, Patentwesen und Urheberrecht D-70548 Stuttgart / DE | Application number, filing date | 95115902.9 | 09.10.1995 | [1996/18] | Priority number, date | US19940332328 | 31.10.1994 Original published format: US 332328 | [1996/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0709887 | Date: | 01.05.1996 | Language: | EN | [1996/18] | Type: | A3 Search report | No.: | EP0709887 | Date: | 14.08.1996 | [1996/33] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.07.1996 | Classification | IPC: | H01L23/532 | [1996/18] | CPC: |
H01L23/53219 (EP,US);
H01L23/5226 (EP,US);
H01L2924/0002 (EP,US);
Y10S438/927 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB [1996/18] | Title | German: | Leitungsstruktur aus Al2Cu für einen integrierten Schaltungschip | [1996/18] | English: | An interconnect structure using Al2Cu for an integrated circuit chip | [1996/18] | French: | Structure d'interconnexion comprenant Al2Cu pour une puce de circuit intégré | [1996/18] | Examination procedure | 27.08.1996 | Examination requested [1996/43] | 08.04.1997 | Despatch of a communication from the examining division (Time limit: M06) | 29.08.1997 | Reply to a communication from the examining division | 25.02.1998 | Despatch of a communication from the examining division (Time limit: M04) | 08.07.1998 | Application deemed to be withdrawn, date of legal effect [1999/01] | 05.08.1998 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1999/01] | Fees paid | Renewal fee | 17.10.1997 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH04111317 ; | [A]FR2143709 (IBM) [A] 1,6 * the whole document *; | [A]EP0395560 (IBM [US]) [A] 1,2 * column A *; | [DA]US5071714 (RODBELL KENNETH P [US], et al); | [A]EP0045405 (IBM [US]) [A] 1 * column W *; | [DA]US4335506 (CHIU GEORGE T, et al) | [A] - A. NAGY ET AL., "Planarized inorganic interlevel dielectric for multilevel metallization - Part I", SOLID STATE TECHNOLOGY, WASHINGTON US, (199101), vol. 34, no. 1, pages 53 - 56, XP000175703 [A] 1 * the whole document * | [A] - PATENT ABSTRACTS OF JAPAN, (19920730), vol. 16, no. 354, Database accession no. (E - 1242), & JP04111317 A 19920413 (SONY CORP) [A] 1-17 * abstract * |