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Extract from the Register of European Patents

EP About this file: EP0717370

EP0717370 - Method of encapsulating a chipcard module and device for performing the method [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  23.08.2002
Database last updated on 11.09.2024
Most recent event   Tooltip25.07.2003Lapse of the patent in a contracting state
New state(s): AT
published on 10.09.2003  [2003/37]
Applicant(s)For all designated states
Gemplus GmbH
Mercedesstrasse 13
70794 Filderstadt / DE
[2002/19]
Former [1998/46]For all designated states
ODS Landis & Gyr GmbH & Co. KG
Ludwig-Erhard-Strasse 16
85375 Neufahrn / DE
Former [1996/25]For all designated states
ODS, R. OLDENBOURG DATENSYSTEME GmbH
Rosenheimer Strasse 145
D-81671 München / DE
Inventor(s)01 / Schmidt, Frank-Thomas, Dr.-Dipl.-Chem.
Nordstrasse 16
D-99891 Fischbach / DE
02 / Schlöffel, Lutz, Dipl.-Ing.
Am Stein 44
D-99846 Seebach / DE
[1996/25]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [1996/25]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date95119841.515.12.1995
[1996/25]
Priority number, dateDE1994444481215.12.1994         Original published format: DE 4444812
[1996/25]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP0717370
Date:19.06.1996
Language:DE
[1996/25]
Type: A3 Search report 
No.:EP0717370
Date:19.02.1997
[1997/08]
Type: B1 Patent specification 
No.:EP0717370
Date:17.10.2001
Language:DE
[2001/42]
Search report(s)(Supplementary) European search report - dispatched on:EP07.01.1997
ClassificationIPC:G06K19/077
[1996/25]
CPC:
H01L21/56 (EP); G06K19/07745 (EP); H01L2224/48091 (EP);
H01L2224/48227 (EP); H01L2224/48472 (EP); H01L2924/01068 (EP)
C-Set:
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/48472, H01L2224/48091, H01L2924/00 (EP);
H01L2224/48472, H01L2224/48227, H01L2924/00 (EP)
Designated contracting statesAT,   CH,   DE,   ES,   FR,   LI [1998/28]
Former [1996/25]AT,  BE,  CH,  DE,  DK,  ES,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Verfahren zum Verkappen eines Chipkartenmoduls und Vorrichtung zum Durchführen des Verfahrens[1996/25]
English:Method of encapsulating a chipcard module and device for performing the method[1996/25]
French:Méthode d'encapsulage d'un module et dispositif pour la mise en oeuvre de la méthode[1996/25]
Examination procedure16.01.1996Loss of particular rights, legal effect: designated state(s)
22.05.1996Despatch of communication of loss of particular rights: designated state(s) BE, DK, GB, GR, IE, IT, LU, MC, NL, PT, SE
10.07.1997Amendment by applicant (claims and/or description)
10.07.1997Examination requested  [1997/37]
12.09.2000Despatch of communication of intention to grant (Approval: Yes)
23.01.2001Communication of intention to grant the patent
27.04.2001Fee for grant paid
27.04.2001Fee for publishing/printing paid
Opposition(s)18.07.2002No opposition filed within time limit [2002/41]
Fees paidRenewal fee
30.12.1997Renewal fee patent year 03
28.12.1998Renewal fee patent year 04
29.12.1999Renewal fee patent year 05
28.12.2000Renewal fee patent year 06
Penalty fee
Penalty fee Rule 85a EPC 1973
04.03.1996BE   M01   Not yet paid
04.03.1996DK   M01   Not yet paid
04.03.1996GB   M01   Not yet paid
04.03.1996GR   M01   Not yet paid
04.03.1996IE   M01   Not yet paid
04.03.1996IT   M01   Not yet paid
04.03.1996LU   M01   Not yet paid
04.03.1996MC   M01   Not yet paid
04.03.1996NL   M01   Not yet paid
04.03.1996PT   M01   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT15.12.2001
CH31.12.2001
LI31.12.2001
[2003/37]
Former [2003/16]CH31.12.2001
LI31.12.2001
Documents cited:Search[XY]JPS60142488  ;
 [A]JPS6086850  ;
 [Y]EP0390046  (MATSUSHITA ELECTRIC IND CO LTD [JP]) [Y] 4,5,7-12 * column 7, line 50 - column 8, line 9; figures 4,6 *;
 [DA]US4962415  (YAMAMOTO HIROSHI [JP], et al) [DA] 1 * column 4, line 36 - column 4, line 45 *
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19851207), vol. 009, no. 312, Database accession no. (P - 411), & JP60142488 A 19850727 (DAINIPPON INSATSU KK) [X] 1-3 * abstract * [Y] 4,5,7-12
 [A]  - PATENT ABSTRACTS OF JAPAN, (19850917), vol. 009, no. 230, Database accession no. (E - 343), & JP60086850 A 19850516 (DAINIPPON INSATSU KK) [A] 1,5 * abstract *
by applicantUS4962415
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.