EP0691802 - Method and composition for forming a multilayer printed circuit board [Right-click to bookmark this link] | |||
Former [1996/02] | Method of forming a multilayer printed circuit board and product thereof | ||
[2001/46] | Status | No opposition filed within time limit Status updated on 04.07.2003 Database last updated on 31.08.2024 | Most recent event Tooltip | 04.01.2008 | Lapse of the patent in a contracting state New state(s): IT | published on 06.02.2008 [2008/06] | Applicant(s) | For all designated states MORTON INTERNATIONAL, INC. 100 North Riverside Plaza Chicago Illinois 60606-1596 / US | [N/P] |
Former [1997/40] | For all designated states Morton International, Inc. 100 North Riverside Plaza Chicago, Illinois 60606-1596 / US | ||
Former [1996/02] | For all designated states MORTON INTERNATIONAL, INC. 100 North Riverside Plaza, Randolph Street at the River Chicago, Illinois 60606 / US | Inventor(s) | 01 /
Rath, James 8731B East Indian Hills Road Orange, California 92669 / US | 02 /
Tran, William Luong-Gia 8651 Amy Avenue Garden Grove, California 92641 / US | 03 /
Flynn, Kathy M. 15742 Kenneth Place Santa Clarita, California 91351 / US | 04 /
Tara, Vinai Ming 1826 West Chateau Avenue Anaheim, California 92804 / US | 05 /
Koes, Thomas A. 17424 Star Canyon Road Riverside, California 92503 / US | 06 /
Nizzo, Vincent J. 13800 Parkcenter Lane, Apt. 229 Tustin, California 92680 / US | [1996/02] | Representative(s) | Bankes, Stephen Charles Digby, et al Baron Warren Redfern 1000 Great West Road Brentford TW8 9DW / GB | [N/P] |
Former [1996/02] | Bankes, Stephen Charles Digby, et al BARON & WARREN 18 South End Kensington London W8 5BU / GB | Application number, filing date | 95304322.1 | 21.06.1995 | [1996/02] | Priority number, date | US19940271614 | 07.07.1994 Original published format: US 271614 | [1996/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0691802 | Date: | 10.01.1996 | Language: | EN | [1996/02] | Type: | B1 Patent specification | No.: | EP0691802 | Date: | 28.08.2002 | Language: | EN | [2002/35] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.10.1995 | Classification | IPC: | H05K3/46, G03F7/027 | [1996/02] | CPC: |
H05K3/064 (EP);
H05K3/00 (KR);
G03F7/027 (EP);
H05K3/4626 (EP);
G03F7/038 (EP);
H05K2201/0209 (EP);
| Designated contracting states | AT, BE, CH, DE, ES, FR, GB, IT, LI, NL, SE [1996/02] | Title | German: | Verfahren und Zusammensetzung zur Herstellung einer mehrschichtigen Leiterplatte | [2001/46] | English: | Method and composition for forming a multilayer printed circuit board | [2001/46] | French: | Procédé et composition de fabrication d'un panneau à circuit imprimé multicouche | [2001/46] |
Former [1996/02] | Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und Produkt | ||
Former [1996/02] | Method of forming a multilayer printed circuit board and product thereof | ||
Former [1996/02] | Procédé de fabrication d'un panneau à circuit imprimé multicouche et produit ainsi obtenu | Examination procedure | 17.06.1996 | Examination requested [1996/33] | 26.06.2000 | Despatch of a communication from the examining division (Time limit: M04) | 18.08.2000 | Reply to a communication from the examining division | 16.11.2001 | Despatch of communication of intention to grant (Approval: Yes) | 06.03.2002 | Communication of intention to grant the patent | 03.04.2002 | Fee for grant paid | 03.04.2002 | Fee for publishing/printing paid | Opposition(s) | 30.05.2003 | No opposition filed within time limit [2003/34] | Fees paid | Renewal fee | 27.06.1997 | Renewal fee patent year 03 | 12.06.1998 | Renewal fee patent year 04 | 28.06.1999 | Renewal fee patent year 05 | 30.06.2000 | Renewal fee patent year 06 | 25.06.2001 | Renewal fee patent year 07 | 24.06.2002 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 28.08.2002 | BE | 28.08.2002 | CH | 28.08.2002 | IT | 28.08.2002 | LI | 28.08.2002 | NL | 28.08.2002 | SE | 28.11.2002 | ES | 28.02.2003 | [2008/06] |
Former [2005/01] | AT | 28.08.2002 | |
BE | 28.08.2002 | ||
CH | 28.08.2002 | ||
LI | 28.08.2002 | ||
NL | 28.08.2002 | ||
SE | 28.11.2002 | ||
ES | 28.02.2003 | ||
Former [2004/04] | AT | 28.08.2002 | |
BE | 28.08.2002 | ||
CH | 28.08.2002 | ||
LI | 28.08.2002 | ||
NL | 28.08.2002 | ||
ES | 28.02.2003 | ||
Former [2003/48] | AT | 28.08.2002 | |
BE | 28.08.2002 | ||
CH | 28.08.2002 | ||
LI | 28.08.2002 | ||
NL | 28.08.2002 | ||
Former [2003/31] | AT | 28.08.2002 | |
CH | 28.08.2002 | ||
LI | 28.08.2002 | ||
NL | 28.08.2002 | ||
Former [2003/22] | NL | 28.08.2002 | Documents cited: | Search | [A]JPS63205313 ; | [A]JPS62265321 ; | [A]EP0403170 (MORTON INT INC [US]) [A] 1-8,11-17,20,21,24 * the whole document *; | [XA]EP0570094 (MORTON INT INC [US]) [X] 1-7,12-16 * the whole document * [A] 8,11,17,20,21,24 | [A] - PATENT ABSTRACTS OF JAPAN, (19881221), vol. 12, no. 491, Database accession no. (C - 554), & JP63205313 A 19880824 (HITACHI) [A] 9,10,18,19,22,23 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19880507), vol. 12, no. 148, Database accession no. (C - 493), & JP62265321 A 19871118 (HITACHI) [A] 9,10,18,19,22,23 * abstract * | by applicant | US3256226 | US3317465 | US3345401 | US3373221 | US3377406 | US3432478 | US3469982 | US3548030 | US3564074 | US3634542 | US3637618 | US4092443 | US4358477 | US4451523 |