blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP0691802

EP0691802 - Method and composition for forming a multilayer printed circuit board [Right-click to bookmark this link]
Former [1996/02]Method of forming a multilayer printed circuit board and product thereof
[2001/46]
StatusNo opposition filed within time limit
Status updated on  04.07.2003
Database last updated on 31.08.2024
Most recent event   Tooltip04.01.2008Lapse of the patent in a contracting state
New state(s): IT
published on 06.02.2008  [2008/06]
Applicant(s)For all designated states
MORTON INTERNATIONAL, INC.
100 North Riverside Plaza Chicago
Illinois 60606-1596 / US
[N/P]
Former [1997/40]For all designated states
Morton International, Inc.
100 North Riverside Plaza
Chicago, Illinois 60606-1596 / US
Former [1996/02]For all designated states
MORTON INTERNATIONAL, INC.
100 North Riverside Plaza, Randolph Street at the River
Chicago, Illinois 60606 / US
Inventor(s)01 / Rath, James
8731B East Indian Hills Road
Orange, California 92669 / US
02 / Tran, William Luong-Gia
8651 Amy Avenue
Garden Grove, California 92641 / US
03 / Flynn, Kathy M.
15742 Kenneth Place
Santa Clarita, California 91351 / US
04 / Tara, Vinai Ming
1826 West Chateau Avenue
Anaheim, California 92804 / US
05 / Koes, Thomas A.
17424 Star Canyon Road
Riverside, California 92503 / US
06 / Nizzo, Vincent J.
13800 Parkcenter Lane, Apt. 229
Tustin, California 92680 / US
[1996/02]
Representative(s)Bankes, Stephen Charles Digby, et al
Baron Warren Redfern
1000 Great West Road
Brentford TW8 9DW / GB
[N/P]
Former [1996/02]Bankes, Stephen Charles Digby, et al
BARON & WARREN 18 South End Kensington
London W8 5BU / GB
Application number, filing date95304322.121.06.1995
[1996/02]
Priority number, dateUS1994027161407.07.1994         Original published format: US 271614
[1996/02]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0691802
Date:10.01.1996
Language:EN
[1996/02]
Type: B1 Patent specification 
No.:EP0691802
Date:28.08.2002
Language:EN
[2002/35]
Search report(s)(Supplementary) European search report - dispatched on:EP26.10.1995
ClassificationIPC:H05K3/46, G03F7/027
[1996/02]
CPC:
H05K3/064 (EP); H05K3/00 (KR); G03F7/027 (EP);
H05K3/4626 (EP); G03F7/038 (EP); H05K2201/0209 (EP);
H05K2203/0571 (EP); H05K3/0023 (EP); H05K3/386 (EP) (-)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   IT,   LI,   NL,   SE [1996/02]
TitleGerman:Verfahren und Zusammensetzung zur Herstellung einer mehrschichtigen Leiterplatte[2001/46]
English:Method and composition for forming a multilayer printed circuit board[2001/46]
French:Procédé et composition de fabrication d'un panneau à circuit imprimé multicouche[2001/46]
Former [1996/02]Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und Produkt
Former [1996/02]Method of forming a multilayer printed circuit board and product thereof
Former [1996/02]Procédé de fabrication d'un panneau à circuit imprimé multicouche et produit ainsi obtenu
Examination procedure17.06.1996Examination requested  [1996/33]
26.06.2000Despatch of a communication from the examining division (Time limit: M04)
18.08.2000Reply to a communication from the examining division
16.11.2001Despatch of communication of intention to grant (Approval: Yes)
06.03.2002Communication of intention to grant the patent
03.04.2002Fee for grant paid
03.04.2002Fee for publishing/printing paid
Opposition(s)30.05.2003No opposition filed within time limit [2003/34]
Fees paidRenewal fee
27.06.1997Renewal fee patent year 03
12.06.1998Renewal fee patent year 04
28.06.1999Renewal fee patent year 05
30.06.2000Renewal fee patent year 06
25.06.2001Renewal fee patent year 07
24.06.2002Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT28.08.2002
BE28.08.2002
CH28.08.2002
IT28.08.2002
LI28.08.2002
NL28.08.2002
SE28.11.2002
ES28.02.2003
[2008/06]
Former [2005/01]AT28.08.2002
BE28.08.2002
CH28.08.2002
LI28.08.2002
NL28.08.2002
SE28.11.2002
ES28.02.2003
Former [2004/04]AT28.08.2002
BE28.08.2002
CH28.08.2002
LI28.08.2002
NL28.08.2002
ES28.02.2003
Former [2003/48]AT28.08.2002
BE28.08.2002
CH28.08.2002
LI28.08.2002
NL28.08.2002
Former [2003/31]AT28.08.2002
CH28.08.2002
LI28.08.2002
NL28.08.2002
Former [2003/22]NL28.08.2002
Documents cited:Search[A]JPS63205313  ;
 [A]JPS62265321  ;
 [A]EP0403170  (MORTON INT INC [US]) [A] 1-8,11-17,20,21,24 * the whole document *;
 [XA]EP0570094  (MORTON INT INC [US]) [X] 1-7,12-16 * the whole document * [A] 8,11,17,20,21,24
 [A]  - PATENT ABSTRACTS OF JAPAN, (19881221), vol. 12, no. 491, Database accession no. (C - 554), & JP63205313 A 19880824 (HITACHI) [A] 9,10,18,19,22,23 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19880507), vol. 12, no. 148, Database accession no. (C - 493), & JP62265321 A 19871118 (HITACHI) [A] 9,10,18,19,22,23 * abstract *
by applicantUS3256226
 US3317465
 US3345401
 US3373221
 US3377406
 US3432478
 US3469982
 US3548030
 US3564074
 US3634542
 US3637618
 US4092443
 US4358477
 US4451523
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.