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EP0730937
European procedure
Extract from the Register of European Patents
EP About this file: EP0730937
| EP0730937 - A resin molding machine with release film [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 23.12.1998 Database last updated on 18.11.2024 | Most recent event Tooltip | 23.12.1998 | No opposition filed within time limit | published on 10.02.1999 [1999/06] | Applicant(s) | For all designated states APIC YAMADA CORPORATION 90, Ooaza Kamitokuma, Togura-machi Hanishina-gun Nagano 389-08 / JP | [N/P] |
| Former [1996/37] | For all designated states APIC YAMADA CORPORATION 90, Ooaza Kamitokuma, Togura-machi Hanishina-gun, Nagano 389-08 / JP | Inventor(s) | 01 /
Miyajima, Fumio, c/o Apic Yamada Corp. 90 Ooaza Kamitokuma, Togura-machi Hanishina-gun, Nagano 389-08 / JP | [1996/37] | Representative(s) | Sanderson, Michael John, et al Mewburn Ellis LLP York House 23 Kingsway London WC2B 6HP / GB | [N/P] |
| Former [1996/37] | Sanderson, Michael John, et al MEWBURN ELLIS York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 95308258.3 | 17.11.1995 | [1996/37] | Priority number, date | JP19940286934 | 21.11.1994 Original published format: JP 28693494 | JP19940286937 | 21.11.1994 Original published format: JP 28693794 | JP19940286944 | 21.11.1994 Original published format: JP 28694494 | JP19940294762 | 29.11.1994 Original published format: JP 29476294 | JP19950030353 | 20.02.1995 Original published format: JP 3035395 | [1996/37] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0730937 | Date: | 11.09.1996 | Language: | EN | [1996/37] | Type: | B1 Patent specification | No.: | EP0730937 | Date: | 18.02.1998 | Language: | EN | [1998/08] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.03.1996 | Classification | IPC: | B29C45/02, H01L21/56, B29C33/68 | [1996/37] | CPC: |
B29C45/463 (EP,US);
B29C45/14 (KR);
B29C33/68 (EP,US);
B29C45/02 (EP,KR,US);
B29C45/14655 (EP,US);
B29C45/37 (EP,US);
H01L21/00 (KR);
H01L21/56 (EP,US);
B29C2045/14663 (EP,US);
H01L2924/0002 (EP,US)
(-)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | CH, DE, FR, GB, IE, LI, NL [1996/37] | Title | German: | Harzformmaschine mit Trennfolie | [1996/37] | English: | A resin molding machine with release film | [1996/37] | French: | Machine pour le moulage de résines avec un film détachable | [1996/37] | Examination procedure | 17.06.1996 | Examination requested [1996/37] | 27.11.1996 | Despatch of a communication from the examining division (Time limit: M04) | 06.03.1997 | Reply to a communication from the examining division | 11.04.1997 | Despatch of a communication from the examining division (Time limit: M04) | 24.04.1997 | Reply to a communication from the examining division | 30.06.1997 | Despatch of communication of intention to grant (Approval: Yes) | 11.08.1997 | Communication of intention to grant the patent | 03.11.1997 | Fee for grant paid | 03.11.1997 | Fee for publishing/printing paid | Opposition(s) | 19.11.1998 | No opposition filed within time limit [1999/06] | Fees paid | Renewal fee | 21.11.1997 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]JPH01202415 ; | [YA]JPS61167515 ; | [X]JPS60131213 ; | [A]JPH06151490 ; | [A]JPH0245117 ; | [A]JPS6251416 ; | [A]JPS62207615 ; | [A]DE3811814 (SIEMENS AG [DE]) [A] 12,13; | [A]US5043199 (KUBOTA AKIHIRO [JP], et al)[A] 15; | [PX]EP0665584 (3P LICENSING BV [NL]) [PX] 1,2,14-18,20,21 * the whole document * | [XY] - PATENT ABSTRACTS OF JAPAN, (19891110), vol. 013, no. 500, Database accession no. (M - 891), & JP01202415 A 19890815 (MATSUDA SEISAKUSHO:KK) [X] 21 * abstract * [Y] 1,2,4,14 | [YA] - PATENT ABSTRACTS OF JAPAN, (19861213), vol. 010, no. 375, Database accession no. (M - 545), & JP61167515 A 19860729 (HITACHI LTD) [Y] 1,2,4,14 * abstract * [A] 11,15-20 | [X] - PATENT ABSTRACTS OF JAPAN, (19851120), vol. 009, no. 294, Database accession no. (M - 431), & JP60131213 A 19850712 (NIPPON SEIKOSHO KK;OTHERS: 01) [X] 21 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19940826), vol. 018, no. 461, Database accession no. (E - 1597), & JP06151490 A 19940531 (TOSHIBA CORP) [A] 1,11,14 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19900426), vol. 014, no. 206, Database accession no. (M - 0967), & JP02045117 A 19900215 (MITSUBISHI ELECTRIC CORP) [A] 1,11,14 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19870805), vol. 011, no. 238, Database accession no. (M - 613), & JP62051416 A 19870306 (SONY CORP) [A] 3,6-9 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19880224), vol. 012, no. 061, Database accession no. (M - 671), & JP62207615 A 19870912 (FUJITSU LTD) [A] 3,6-9 * abstract * |