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Extract from the Register of European Patents

EP About this file: EP0750790

EP0750790 - METHOD AND APPARATUS FOR CAPPING METALLIZATION LAYER [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  18.06.1999
Database last updated on 25.09.2024
Most recent event   Tooltip18.06.1999Application deemed to be withdrawnpublished on 04.08.1999 [1999/31]
Applicant(s)For all designated states
NATIONAL SEMICONDUCTOR CORPORATION
2900 Semiconductor Drive, M/S D3-579
Santa Clara, CA 95051 / US
[N/P]
Former [1997/01]For all designated states
NATIONAL SEMICONDUCTOR CORPORATION
2900 Semiconductor Drive, M/S D3-579
Santa Clara, CA 95051 / US
Inventor(s)01 / WEILER, Peter, M.
3476 Greer Road
Palo Alto, CA 94303 / US
[1997/01]
Representative(s)Bowles, Sharon Margaret, et al
BOWLES HORTON
Felden House
Dower Mews
High Street
Berkhamsted Hertfordshire HP4 2BL / GB
[N/P]
Former [1997/01]Bowles, Sharon Margaret, et al
BOWLES HORTON Felden House Dower Mews High Street
Berkhamsted Hertfordshire HP4 2BL / GB
Application number, filing date95944223.726.12.1995
[1997/01]
WO1995US16844
Priority number, dateUS1995037238613.01.1995         Original published format: US 372386
[1997/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9621944
Date:18.07.1996
Language:EN
[1996/33]
Type: A1 Application with search report 
No.:EP0750790
Date:02.01.1997
Language:EN
The application published by WIPO in one of the EPO official languages on 18.07.1996 takes the place of the publication of the European patent application.
[1997/01]
Search report(s)International search report - published on:EP18.07.1996
ClassificationIPC:H01L21/60, H01L23/485
[1997/01]
CPC:
H01L21/60 (KR); H01L24/03 (EP,US); H01L24/05 (EP,US);
H01L24/11 (EP,US); H01L2224/02166 (EP,US); H01L2224/0401 (EP,US);
H01L2224/04042 (EP,US); H01L2224/05082 (EP,US); H01L2224/05083 (EP,US);
H01L2224/05147 (EP,US); H01L2224/05166 (EP,US); H01L2224/05184 (EP,US);
H01L2224/05644 (EP,US); H01L2224/05647 (EP,US); H01L2224/1148 (EP,US);
H01L2224/13099 (EP,US); H01L2224/45144 (EP,US); H01L2224/48644 (EP,US);
H01L2224/48647 (EP,US); H01L24/45 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01022 (EP,US); H01L2924/01023 (EP,US);
H01L2924/01028 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01057 (EP,US); H01L2924/01072 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/01327 (EP,US);
H01L2924/14 (EP,US) (-)
C-Set:
H01L2224/04042, H01L2924/00, H01L2224/45144, H01L2924/00015 (EP,US);
H01L2224/05647, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00014 (EP,US);
H01L2224/48644, H01L2924/00 (US,EP);
H01L2224/48647, H01L2924/00 (US,EP)
(-)
Designated contracting statesDE,   FR,   GB [1997/01]
TitleGerman:VERFAHREN UND VORRICHTUNG ZUM ABDECKEN EINER METALLISIERUNGSSCHICHT[1997/01]
English:METHOD AND APPARATUS FOR CAPPING METALLIZATION LAYER[1997/01]
French:PROCEDE ET DISPOSITIF POUR LA FORMATION D'UNE COUCHE DE METALLISATION[1997/01]
Entry into regional phase05.10.1996National basic fee paid 
05.10.1996Designation fee(s) paid 
13.12.1996Examination fee paid 
Examination procedure16.09.1996Amendment by applicant (claims and/or description)
13.12.1996Examination requested  [1997/07]
02.05.1997Despatch of a communication from the examining division (Time limit: M06)
09.02.1998Reply to a communication from the examining division
31.07.1998Despatch of a communication from the examining division (Time limit: M06)
11.02.1999Application deemed to be withdrawn, date of legal effect  [1999/31]
10.03.1999Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1999/31]
Request for further processing for:09.02.1998Request for further processing filed
09.02.1998Full payment received (date of receipt of payment)
Request granted
20.02.1998Decision despatched
Fees paidRenewal fee
12.11.1997Renewal fee patent year 03
04.12.1998Renewal fee patent year 04
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XY]GB2004686  (TEXAS INSTRUMENTS INC) [X] 1,3,5,10-12,21,24 * the whole document * [Y] 2,7,15,18,23;
 [AY]JPS5516425  ;
 [AY]US5136364  (BYRNE ROBERT C [US]) [A] 1,5-7,10-12,18,21 * column W * [Y] 15;
 [A]JPH01166542  ;
 [A]JPS63114145  ;
 [A]JPS59172252  ;
 [A]JPS6331138  ;
 [A]EP0396276  (NEC CORP [JP]) [A] 1,2,5,10-12,21,23 * column A *;
 [A]EP0339871  (ADVANCED MICRO DEVICES INC [US])
 [AY]  - PATENT ABSTRACTS OF JAPAN, (19800405), vol. 4, no. 44, Database accession no. (E - 005), & JP55016425 A 19800205 (TOSHIBA CORP) [A] 1,3,5,10,12,21,24 * abstract * [Y] 2,7,18,23
 [A]  - PATENT ABSTRACTS OF JAPAN, (19891003), vol. 13, no. 439, Database accession no. (E - 827), & JP01166542 A 19890630 (FUJITSU) [A] 1,2,10,21 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19880926), vol. 12, no. 357, Database accession no. (E - 662), & JP63114145 A 19880519 (NEC CORP) [A] 1,5,10,12 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19850206), vol. 9, no. 27, Database accession no. (E - 294), & JP59172252 A 19840928 (HITACHI MAIKURO COMPUTER ENGINEERING KK) [A] 1,2,5,7,10,12,18,21 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19880707), vol. 12, no. 239, Database accession no. (E - 630), & JP63031138 A 19880209 (FUJITSU) [A] 1,5,10,12 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.