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Extract from the Register of European Patents

EP About this file: EP0732706

EP0732706 - Method of improving the electrical conductivity of a shaped resin article and an electrostatic coating process [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  23.11.2001
Database last updated on 19.07.2024
Most recent event   Tooltip23.11.2001No opposition filed within time limitpublished on 09.01.2002  [2002/02]
Applicant(s)For all designated states
Dai-Ichi Kogyo Seiyaku Co., Ltd.
55 Nishishichijo Higashikubo-cho Shimogyo-ku
Kyoto / JP
[N/P]
Former [1996/38]For all designated states
DAI-ICHI KOGYO SEIYAKU CO., LTD.
55 Nishishichijo Higashikubo-cho
Shimogyo-ku Kyoto / JP
Inventor(s)01 / Shiraiwa, Tetsuo
13-1-1106, Matsuyacho
Neyagawa, Osaka / JP
[1996/38]
Representative(s)Strehl Schübel-Hopf & Partner
Maximilianstrasse 54
80538 München / DE
[N/P]
Former [1996/38]Strehl Schübel-Hopf Groening & Partner
Maximilianstrasse 54
80538 München / DE
Application number, filing date96102601.021.02.1996
[1996/38]
Priority number, dateJP1995005570115.03.1995         Original published format: JP 5570195
[1996/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0732706
Date:18.09.1996
Language:EN
[1996/38]
Type: A3 Search report 
No.:EP0732706
Date:16.10.1996
[1996/42]
Type: B1 Patent specification 
No.:EP0732706
Date:17.01.2001
Language:EN
[2001/03]
Search report(s)(Supplementary) European search report - dispatched on:EP27.08.1996
ClassificationIPC:H01B1/12, B05D1/04
[1996/38]
CPC:
H01B1/12 (EP,US); C08J7/00 (KR); B05D1/045 (EP,US);
B05D7/02 (KR)
Designated contracting statesDE,   GB [1996/38]
TitleGerman:Verfahren zur Verbesserung der elektrischen Leitfähigkeit eines Harzformkörpers und Verfahren zur elektrostatischen Beschichtung[1996/38]
English:Method of improving the electrical conductivity of a shaped resin article and an electrostatic coating process[1996/38]
French:Procédé d'amélioration de la conductivité électrique d'un article moulé en résine et procédé de revêtement par voie électrostatique[1996/38]
Examination procedure16.04.1997Examination requested  [1997/24]
04.04.2000Despatch of communication of intention to grant (Approval: Yes)
05.07.2000Communication of intention to grant the patent
05.10.2000Fee for grant paid
05.10.2000Fee for publishing/printing paid
Opposition(s)18.10.2001No opposition filed within time limit [2002/02]
Fees paidRenewal fee
24.02.1998Renewal fee patent year 03
23.02.1999Renewal fee patent year 04
17.02.2000Renewal fee patent year 05
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Documents cited:Search[AP]EP0675505  (DAI ICHI KOGYO SEIYAKU CO LTD [JP]) [AP] 1-3
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