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Extract from the Register of European Patents

EP About this file: EP0751562

EP0751562 - Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.05.2002
Database last updated on 31.08.2024
Most recent event   Tooltip04.01.2008Lapse of the patent in a contracting state
New state(s): IT
published on 06.02.2008  [2008/06]
Applicant(s)For all designated states
Braun GmbH
Kronberg / DE
[1999/50]
Former [1997/01]For all designated states
Braun Aktiengesellschaft
60326 Frankfurt am Main / DE
Inventor(s)01 / Hiller, Hans-Martin
Im Dammwald 10
61381 Friedrichsdorf / DE
02 / Stratmann, Martin
Scheffelstrasse 9
60318 Frankfurt am Main / DE
03 / Werhahn, Friedrich
Am Kornfeld 1
97828 Marktheidenfeld / DE
04 / Debus, Wolfram
Hünerbergstrasse 1
61476 Kronberg / DE
05 / Oppermann, Günter
Kirchbornstrasse 17
63128 Dietzenbach / DE
[1997/01]
Application number, filing date96106943.203.05.1996
[1997/01]
Priority number, dateDE199512336627.06.1995         Original published format: DE 19523366
DE199513325108.09.1995         Original published format: DE 19533251
[1997/01]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP0751562
Date:02.01.1997
Language:DE
[1997/01]
Type: A3 Search report 
No.:EP0751562
Date:11.06.1997
[1997/24]
Type: B1 Patent specification 
No.:EP0751562
Date:18.07.2001
Language:DE
[2001/29]
Search report(s)(Supplementary) European search report - dispatched on:EP25.04.1997
ClassificationIPC:H01L23/367
[1997/01]
CPC:
H01L23/3672 (EP,US); H01L23/3677 (EP,US); H01L23/3736 (EP,US);
H05K1/0204 (EP,US); H01L2924/0002 (EP,US); H05K2201/0382 (EP,US);
H05K2201/0397 (EP,US); H05K2201/09054 (EP,US); H05K2201/10166 (EP,US);
H05K2201/10416 (EP,US); Y10T29/49142 (EP,US); Y10T29/49144 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   CH,   DE,   ES,   FR,   GB,   IT,   LI,   NL [1997/01]
TitleGerman:Wärmeleite-Befestigung eines elektronischen Leistungsbauelementes auf einer Leiterplatte mit Kühlblech[1997/01]
English:Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator[1997/01]
French:Fixation thermiquement conductive d'un dispositif électronique de puissance sur une plaquette de circuit avec dissipateur de chaleur[1997/01]
Examination procedure21.10.1997Examination requested  [1997/51]
02.08.1999Despatch of a communication from the examining division (Time limit: M04)
01.12.1999Reply to a communication from the examining division
14.04.2000Despatch of a communication from the examining division (Time limit: M04)
19.07.2000Reply to a communication from the examining division
30.10.2000Despatch of communication of intention to grant (Approval: Yes)
08.12.2000Communication of intention to grant the patent
24.02.2001Fee for grant paid
24.02.2001Fee for publishing/printing paid
Opposition(s)19.04.2002No opposition filed within time limit [2002/28]
Fees paidRenewal fee
11.04.1998Renewal fee patent year 03
15.04.1999Renewal fee patent year 04
26.04.2000Renewal fee patent year 05
05.05.2001Renewal fee patent year 06
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Lapses during opposition  TooltipIT18.07.2001
NL18.07.2001
ES31.01.2002
[2008/06]
Former [2004/04]NL18.07.2001
ES31.01.2002
Former [2003/09]NL18.07.2001
FR21.12.2001
Former [2002/18]FR21.12.2001
Documents cited:Search[A]US3825803  (BUDDE H) [A] 1,2,5,7 * figures 1-5 *;
 [A]US4924352  (SEPTFONS RENE [FR]) [A] 11 * abstract *;
 [A]US5014904  (MORTON DAVID M [US]) [A] 1-13 * column W *;
 [A]DE4102265  (TELEFUNKEN ELECTRONIC GMBH [DE], et al);
 [A]DE4204391  (RHEINMETALL GMBH [DE]) [A] 1-13 * the whole document *;
 [A]DE4226168  (SEL ALCATEL AG [DE]) [A] 1,2 * abstract *;
 [A]DE4330975  (BOSCH GMBH ROBERT [DE]) [A] 1-13 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.