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Extract from the Register of European Patents

EP About this file: EP0786804

EP0786804 - Apparatus and method for processing substrates [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  14.01.2000
Database last updated on 03.10.2024
Most recent event   Tooltip14.01.2000Application deemed to be withdrawnpublished on 01.03.2000 [2000/09]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
M/S 2061
Santa Clara, California 95054-3299 / US
[N/P]
Former [1997/31]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue, M/S 2061
Santa Clara, California 95054-3299 / US
Inventor(s)01 / Ye, Yan
3862 Via Salice
Cambell / US
02 / Yin, Gerald Zheyao
10132 Bilich Place
Cupertino, CA 95014 / US
03 / Ma, Diana Xiabing
19600 Kilt Court
California / US
04 / Mak, Steve S.Y.
878 Montevino Drive
Pleasanton, California 94566 / US
[1997/31]
Representative(s)Bayliss, Geoffrey Cyril, et al
BOULT WADE TENNANT
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
[N/P]
Former [1997/31]Bayliss, Geoffrey Cyril, et al
BOULT WADE TENNANT, 27 Furnival Street
London EC4A 1PQ / GB
Application number, filing date96309550.024.12.1996
[1997/31]
Priority number, dateUS1996059282126.01.1996         Original published format: US 592821
[1997/31]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0786804
Date:30.07.1997
Language:EN
[1997/31]
Type: A3 Search report 
No.:EP0786804
Date:08.10.1997
[1997/41]
Search report(s)(Supplementary) European search report - dispatched on:EP25.08.1997
ClassificationIPC:H01J37/32, C23C16/44, H01L21/306
[1997/39]
CPC:
H01L21/67069 (EP,US); H01L21/205 (KR); H01J37/3244 (EP,US);
H01J37/32642 (EP,US); H01L21/68721 (EP,US); Y10S156/915 (EP,US)
Former IPC [1997/31]H01L21/306, H05H1/46, H01J37/32
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   GR,   IE,   IT,   LI,   NL,   SE [1997/31]
TitleGerman:Vorrichtung und Verfahren zum Behandeln von Substraten[1997/31]
English:Apparatus and method for processing substrates[1997/31]
French:Appareil et méthode pour le traitement de substrats[1997/31]
Examination procedure27.03.1998Examination requested  [1998/22]
01.04.1999Despatch of a communication from the examining division (Time limit: M04)
12.08.1999Application deemed to be withdrawn, date of legal effect  [2000/09]
17.09.1999Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2000/09]
Fees paidRenewal fee
30.11.1998Renewal fee patent year 03
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Documents cited:Search[X]US5213658  (ISHIDA TOMOAKI [JP]) [X] 20 * figure 1; claim 1 *;
 [A]EP0639850  (IBM [US]) [A] 1,7-9,13,20 * figures 8,13,14; claim 1 *;
 [DA]US5423918  (GUPTA ANAND [US], et al) [DA] 1,7,8,13-17,20* column 3, line 45 - column 4, line 9; figures 1,3 *;
 [PA]US5552124  (SU YIN-JIA [US]) [PA] 1,7-9,20 * column 2, line 43 - column 3, line 9; figures 2-11; claim 1 *;
 [PX]US5556500  (HASEGAWA MAKOTO [JP], et al) [PX] 1,13,20 * figures 1,4; claim 1 *;
 [PX]US5578164  (KURONO YOICHI [JP], et al) [PX] 1,7,13,14,16,17 * column 5, line 63 - column 6, line 54; figure 3 *
by applicantUS5201990
 US5423918
 EP0694949
    - SZE S.M., VLSI Technology., NEW YORK., MCGRAW-HILL PUBLISHING CO.
 US19940277531
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.