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EP0740497
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EP About this file: EP0740497
| EP0740497 - Electric interconnection substrate [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 05.09.2003 Database last updated on 02.11.2024 | Most recent event Tooltip | 05.09.2003 | Application deemed to be withdrawn | published on 22.10.2003 [2003/43] | Applicant(s) | For all designated states Dyconex AG Grindelstrasse 40 8303 Bassersdorf / CH | For all designated states Hewlett-Packard GmbH Herrenberger Strasse 130 D-71034 Böblingen / DE | [2003/06] |
| Former [1996/44] | For all designated states DYCONEX PATENTE AG c/o Heinze & Co. Baarerstrasse 43 6300 Zug / CH | ||
| For all designated states Hewlett-Packard GmbH Herrenberger Strasse 130 D-71034 Böblingen / DE | Inventor(s) | 01 /
Schmidt, Walter Oberwiesenstrasse 73f 8050 Zürich / CH | 02 /
Dippon, Siegfried Roseneggerstrasse 12 75391 Gechingen / DE | [1996/44] | Representative(s) | Frei, Alexandra Sarah Frei Patentanwaltsbüro Postfach 1771 8032 Zürich / CH | [N/P] |
| Former [1996/44] | Frei, Alexandra Sarah Frei Patentanwaltsbüro Hedwigsteig 6 Postfach 768 8029 Zürich / CH | Application number, filing date | 96810156.8 | 14.03.1996 | [1996/44] | Priority number, date | CH19950001166 | 24.04.1995 Original published format: CH 116695 | [1996/44] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0740497 | Date: | 30.10.1996 | Language: | DE | [1996/44] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.08.1996 | Classification | IPC: | H05K3/42, H05K3/40 | [1996/44] | CPC: |
H05K3/421 (EP);
H05K3/0041 (EP);
H05K3/403 (EP);
H05K1/0289 (EP);
H05K2201/0394 (EP);
H05K2201/09509 (EP);
H05K2201/09645 (EP);
H05K2201/09809 (EP);
H05K2201/09827 (EP);
H05K2203/0346 (EP);
H05K2203/0554 (EP);
H05K2203/1184 (EP);
H05K3/0082 (EP);
H05K3/064 (EP);
H05K3/108 (EP);
H05K3/427 (EP)
(-)
| Designated contracting states | CH, DE, GB, LI [1996/44] | Title | German: | Elektrisches Verbindungssubstrat | [1996/44] | English: | Electric interconnection substrate | [1996/44] | French: | Substrat d'interconnexion électrique | [1996/44] | Examination procedure | 24.04.1997 | Amendment by applicant (claims and/or description) | 24.04.1997 | Examination requested [1997/26] | 11.12.2002 | Despatch of a communication from the examining division (Time limit: M04) | 23.04.2003 | Application deemed to be withdrawn, date of legal effect [2003/43] | 26.05.2003 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2003/43] | Fees paid | Renewal fee | 14.03.1998 | Renewal fee patent year 03 | 18.03.1999 | Renewal fee patent year 04 | 21.02.2000 | Renewal fee patent year 05 | 21.02.2001 | Renewal fee patent year 06 | 22.03.2002 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 31.03.2003 | 08 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAY]US3284322 (PEARLSTEIN) [X] 1-5,8,10 * column W * [A] 16,17 [Y] 6,11,12; | [YA]EP0575292 (DYCONEX PATENTE AG) [Y] 6,11,12 * page 3, lines 26-51; figures 1-4 * [A] 18; | [X]US3349162 (ECKHARDT ET AL.) [X] 1-5,8,10 * column 3, line 55 - column 6, line 43; figures 8-10 *; | [X]US3400210 (REIMER) [X] 1-5,10,13 * column W *; | [A]US4118523 (BINGHAM ET AL.) [A] 6,11,18 * figure -; claim - *; | [A]US4517050 (JOHNSON ET AL.) [A] 1,2,4-7,9,11,17,18 * figure 1; claim - * | [XA] - R. C. ANDERSON, D. DINELLA, "Printed circuit boards with multiconductor through-holes", TECHNICAL DIGEST - WESTERN ELECTRIC, NEW YORK US, (197601), no. 41, pages 1 - 2, XP002008961 [X] 1-6,8,10,13 * the whole document * [A] 16,17 |