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EP0741507
European procedure
Extract from the Register of European Patents
EP About this file: EP0741507
| EP0741507 - Arrangement for integrated circuits and a method for mounting the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 17.09.1999 Database last updated on 24.08.2024 | Most recent event Tooltip | 17.09.1999 | No opposition filed within time limit | published on 03.11.1999 [1999/44] | Applicant(s) | For all designated states Telefonaktiebolaget LM Ericsson (publ) 164 83 Stockholm / SE | [N/P] |
| Former [1996/45] | For all designated states TELEFONAKTIEBOLAGET LM ERICSSON 126 25 Stockholm / SE | Inventor(s) | 01 /
Fagerholt, Anders Alegardsgatan 123 431 50 Mölndal / SE | [1996/45] | Representative(s) | Mossmark, Anders Lennart, et al Zacco Sweden AB Torggatan 8 Box 142 401 22 Göteborg / SE | [N/P] |
| Former [1996/45] | Mossmark, Anders, et al Albihn West AB, Box 142 401 22 Göteborg / SE | Application number, filing date | 96850033.0 | 14.02.1996 | [1996/45] | Priority number, date | SE19950000558 | 16.02.1995 Original published format: SE 9500558 | [1996/45] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0741507 | Date: | 06.11.1996 | Language: | EN | [1996/45] | Type: | B1 Patent specification | No.: | EP0741507 | Date: | 11.11.1998 | Language: | EN | [1998/46] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.06.1996 | Classification | IPC: | H05K7/20, H05K7/06, H01L23/36 | [1996/45] | CPC: |
H05K1/141 (EP);
H01L23/04 (EP);
H01L23/36 (EP);
H01L23/49833 (EP);
H01L23/642 (EP);
H01L23/647 (EP);
H01L2224/48091 (EP);
H01L2224/48465 (EP);
H01L2224/49171 (EP);
H01L24/48 (EP);
H01L24/49 (EP);
H01L2924/00014 (EP);
H01L2924/14 (EP);
H01L2924/15192 (EP);
H01L2924/16152 (EP);
H01L2924/19041 (EP);
H01L2924/3025 (EP);
H05K1/0284 (EP);
H05K1/182 (EP);
H05K2201/049 (EP);
H05K2201/09036 (EP);
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP);
H01L2924/00014, H01L2224/45099 (EP)
| Designated contracting states | DE, FR, GB, NL [1996/45] | Title | German: | Arrangement für integrierte Kreise und Methode zur Montierung davon | [1996/45] | English: | Arrangement for integrated circuits and a method for mounting the same | [1996/45] | French: | Dispositif pour circuits intégrés et procédé d'installation | [1996/45] | Examination procedure | 02.05.1997 | Examination requested [1997/27] | 23.01.1998 | Despatch of communication of intention to grant (Approval: Yes) | 18.05.1998 | Communication of intention to grant the patent | 21.08.1998 | Fee for grant paid | 21.08.1998 | Fee for publishing/printing paid | Opposition(s) | 12.08.1999 | No opposition filed within time limit [1999/44] | Fees paid | Renewal fee | 04.02.1998 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US5297006 (MIZUKOSHI MASATAKA [JP]) [X] 1-4,7 |