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Extract from the Register of European Patents

EP About this file: EP0882562

EP0882562 - Disc molding die [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  13.07.2002
Database last updated on 06.07.2024
Most recent event   Tooltip13.07.2002No opposition filed within time limitpublished on 28.08.2002  [2002/35]
Applicant(s)For all designated states
SEIKOH GIKEN Co., Ltd.
286-23, Matsuhidai Matsudo-shi
Chiba 270 / JP
For all designated states
SUMITOMO HEAVY INDUSTRIES, LTD.
9-11, Kitashinagawa 5-chome Shinagawa-ku
Tokyo 141-8686 / JP
[N/P]
Former [2001/36]For all designated states
SEIKOH GIKEN Co., Ltd.
286-23, Matsuhidai
Matsudo-shi, Chiba 270 / JP
For all designated states
SUMITOMO HEAVY INDUSTRIES, LTD.
9-11, Kitashinagawa 5-chome
Shinagawa-ku, Tokyo 141-8686 / JP
Former [1998/50]For all designated states
SEIKOH GIKEN Co., Ltd.
286-23, Matsuhidai
Matsudo-shi, Chiba 270 / JP
For all designated states
SUMITOMO HEAVY INDUSTRIES, LTD.
9-11, Kitashinagawa 5-chome
Shinagawa-ku, Tokyo 141 / JP
Inventor(s)01 / Sakamoto, Yasuyoshi
3-5-22-4, Minamihatsutomi
Kamagaya-shi, Chiba 273-01 / JP
02 / Hatano, Akira
4-55-1, Chiharadia, 1842, Kusakari
Ichihara-shi, Chiba 290 / JP
[1998/50]
Representative(s)Boeters, Hans Dietrich, et al
BOETERS & LIECK
Oberanger 32
80331 München / DE
[N/P]
Former [1998/50]Boeters, Hans Dietrich, Dr., et al
Patentanwälte Boeters & Bauer, Bereiteranger 15
81541 München / DE
Application number, filing date97109150.905.06.1997
[1998/50]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0882562
Date:09.12.1998
Language:EN
[1998/50]
Type: B1 Patent specification 
No.:EP0882562
Date:05.09.2001
Language:EN
[2001/36]
Search report(s)(Supplementary) European search report - dispatched on:EP18.12.1997
ClassificationIPC:B29C45/26
[1998/50]
CPC:
B29C45/263 (EP); B29C2045/2646 (EP)
Designated contracting statesAT,   CH,   DE,   FR,   GB,   IT,   LI [1998/50]
TitleGerman:Giessform für eine Platte[1998/50]
English:Disc molding die[1998/50]
French:Moule pour former un disque[1998/50]
Examination procedure11.02.1998Examination requested  [1998/50]
23.08.1999Despatch of a communication from the examining division (Time limit: M04)
29.12.1999Reply to a communication from the examining division
04.10.2000Despatch of communication of intention to grant (Approval: Yes)
23.01.2001Communication of intention to grant the patent
29.03.2001Fee for grant paid
29.03.2001Fee for publishing/printing paid
Opposition(s)06.06.2002No opposition filed within time limit [2002/35]
Fees paidRenewal fee
28.06.1999Renewal fee patent year 03
29.06.2000Renewal fee patent year 04
29.06.2001Renewal fee patent year 05
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Documents cited:Search[XA]JPH08309804  ;
 [X]JPH07266378  ;
 [X]JPH08300421  ;
 [A]JPH06293047
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 97, no. 3, & JP08309804 A 19961126 (MEIKI CO LTD) [X] 1,2 * abstract * [A] 4
 [X]  - PATENT ABSTRACTS OF JAPAN, (19960229), vol. 96, no. 2, & JP07266378 A 19951017 (TOSHIBA EMI LTD) [X] 1,2 * abstract *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 97, no. 3, & JP08300421 A 19961119 (PIONEER ELECTRON CORP;PIONEER VIDEO CORP) [X] 1,3 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19950228), vol. 95, no. 1, & JP06293047 A 19941021 (SONY CORP) [A] 1 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.