EP0882562 - Disc molding die [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.07.2002 Database last updated on 06.07.2024 | Most recent event Tooltip | 13.07.2002 | No opposition filed within time limit | published on 28.08.2002 [2002/35] | Applicant(s) | For all designated states SEIKOH GIKEN Co., Ltd. 286-23, Matsuhidai Matsudo-shi Chiba 270 / JP | For all designated states SUMITOMO HEAVY INDUSTRIES, LTD. 9-11, Kitashinagawa 5-chome Shinagawa-ku Tokyo 141-8686 / JP | [N/P] |
Former [2001/36] | For all designated states SEIKOH GIKEN Co., Ltd. 286-23, Matsuhidai Matsudo-shi, Chiba 270 / JP | ||
For all designated states SUMITOMO HEAVY INDUSTRIES, LTD. 9-11, Kitashinagawa 5-chome Shinagawa-ku, Tokyo 141-8686 / JP | |||
Former [1998/50] | For all designated states SEIKOH GIKEN Co., Ltd. 286-23, Matsuhidai Matsudo-shi, Chiba 270 / JP | ||
For all designated states SUMITOMO HEAVY INDUSTRIES, LTD. 9-11, Kitashinagawa 5-chome Shinagawa-ku, Tokyo 141 / JP | Inventor(s) | 01 /
Sakamoto, Yasuyoshi 3-5-22-4, Minamihatsutomi Kamagaya-shi, Chiba 273-01 / JP | 02 /
Hatano, Akira 4-55-1, Chiharadia, 1842, Kusakari Ichihara-shi, Chiba 290 / JP | [1998/50] | Representative(s) | Boeters, Hans Dietrich, et al BOETERS & LIECK Oberanger 32 80331 München / DE | [N/P] |
Former [1998/50] | Boeters, Hans Dietrich, Dr., et al Patentanwälte Boeters & Bauer, Bereiteranger 15 81541 München / DE | Application number, filing date | 97109150.9 | 05.06.1997 | [1998/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0882562 | Date: | 09.12.1998 | Language: | EN | [1998/50] | Type: | B1 Patent specification | No.: | EP0882562 | Date: | 05.09.2001 | Language: | EN | [2001/36] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.12.1997 | Classification | IPC: | B29C45/26 | [1998/50] | CPC: |
B29C45/263 (EP);
B29C2045/2646 (EP)
| Designated contracting states | AT, CH, DE, FR, GB, IT, LI [1998/50] | Title | German: | Giessform für eine Platte | [1998/50] | English: | Disc molding die | [1998/50] | French: | Moule pour former un disque | [1998/50] | Examination procedure | 11.02.1998 | Examination requested [1998/50] | 23.08.1999 | Despatch of a communication from the examining division (Time limit: M04) | 29.12.1999 | Reply to a communication from the examining division | 04.10.2000 | Despatch of communication of intention to grant (Approval: Yes) | 23.01.2001 | Communication of intention to grant the patent | 29.03.2001 | Fee for grant paid | 29.03.2001 | Fee for publishing/printing paid | Opposition(s) | 06.06.2002 | No opposition filed within time limit [2002/35] | Fees paid | Renewal fee | 28.06.1999 | Renewal fee patent year 03 | 29.06.2000 | Renewal fee patent year 04 | 29.06.2001 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]JPH08309804 ; | [X]JPH07266378 ; | [X]JPH08300421 ; | [A]JPH06293047 | [XA] - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 97, no. 3, & JP08309804 A 19961126 (MEIKI CO LTD) [X] 1,2 * abstract * [A] 4 | [X] - PATENT ABSTRACTS OF JAPAN, (19960229), vol. 96, no. 2, & JP07266378 A 19951017 (TOSHIBA EMI LTD) [X] 1,2 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 97, no. 3, & JP08300421 A 19961119 (PIONEER ELECTRON CORP;PIONEER VIDEO CORP) [X] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19950228), vol. 95, no. 1, & JP06293047 A 19941021 (SONY CORP) [A] 1 * abstract * |