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EP0828262
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EP About this file: EP0828262
| EP0828262 - Method of soldering lead wires to ceramic components [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 23.08.2002 Database last updated on 19.07.2024 | Most recent event Tooltip | 23.08.2002 | Application deemed to be withdrawn | published on 09.10.2002 [2002/41] | Applicant(s) | For all designated states EPCOS AG St.-Martin-Strasse 53 81541 München / DE | [2000/28] |
| Former [1998/11] | For all designated states SIEMENS MATSUSHITA COMPONENTS GmbH & CO KG Balanstrasse 73 81541 München / DE | Inventor(s) | 01 /
Strallhofer, Oliver, Ing. Ed. Keilgasse 156 8041 Graz / AT | 02 /
Lampl, Ewald, Dipl.-Ing. Altenmarkt 270Strasse 188 8551 Wies / AT | [1998/11] | Representative(s) | Epping, Wilhelm, et al Epping Hermann Fischer Patentanwaltsgesellschaft mbH Schlossschmidstrasse 5 80639 München / DE | [N/P] |
| Former [2000/28] | Epping, Wilhelm, Dipl.-Ing., et al Epping Hermann & Fischer Ridlerstrasse 55 80339 München / DE | ||
| Former [1998/28] | Epping, Wilhelm, Dr.-Ing., et al Patentanwalt Postfach 22 13 17 80503 München / DE | ||
| Former [1998/11] | Fuchs, Franz-Josef, Dr.-Ing., et al Postfach 22 13 17 80503 München / DE | Application number, filing date | 97114226.0 | 18.08.1997 | [1998/11] | Priority number, date | DE1996136577 | 09.09.1996 Original published format: DE 19636577 | [1998/11] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0828262 | Date: | 11.03.1998 | Language: | DE | [1998/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.11.1997 | Classification | IPC: | H01C17/28, H01C1/144, H01C1/14 | [1998/11] | CPC: |
H01C17/28 (EP);
H01C1/1406 (EP);
H01C1/144 (EP)
| Designated contracting states | DE, ES, IT, SE [1998/48] |
| Former [1998/11] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Verfahren zum Anlöten von Anschlussdrähten an keramische Bauelemente | [1998/11] | English: | Method of soldering lead wires to ceramic components | [1998/11] | French: | Procédé pour souder des fils de connexion à des composants céramiques | [1998/11] | Examination procedure | 02.09.1998 | Examination requested [1998/44] | 01.03.2002 | Application deemed to be withdrawn, date of legal effect [2002/41] | 08.05.2002 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2002/41] | Fees paid | Renewal fee | 20.08.1999 | Renewal fee patent year 03 | 21.07.2000 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 31.08.2001 | 05 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US4915286 (MENTZER REGIS ET AL) [X] 1,2 * column 2, line 28 - column 4, line 19; figures 1-6; claims 1,3 *; | [A]JPS62106652 ; | [A]JPS61124024 | [A] - PATENT ABSTRACTS OF JAPAN, (19871013), vol. 011, no. 314, Database accession no. (E - 549), & JP62106652 A 19870518 (FUJIKURA LTD) [A] * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19861024), vol. 010, no. 313, Database accession no. (E - 448), & JP61124024 A 19860611 (HITACHI LTD) [A] * abstract * |