-
EP0837115
European procedure
Extract from the Register of European Patents
EP About this file: EP0837115
| EP0837115 - Method for cutting wafers from a crystal [Right-click to bookmark this link] | |||
| Former [1998/17] | Slicing slurry and method for cutting wafers from a crystal | ||
| [1999/11] | Status | No opposition filed within time limit Status updated on 03.11.2000 Database last updated on 10.05.2025 | Most recent event Tooltip | 03.11.2000 | No opposition filed within time limit | published on 20.12.2000 [2000/51] | Applicant(s) | For all designated states Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Johannes-Hess-Strasse 24 84489 Burghausen / DE | [N/P] |
| Former [1998/17] | For all designated states Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Johannes-Hess-Strasse 24 84489 Burghausen / DE | Inventor(s) | 01 /
Knepprath, Vernon 20090 SE Fairway Damascus, Oregon / US | 02 /
Frank, Walter Watzmannring 25 84508 Burgkirchen Alz / DE | 03 /
Kaeser, Maximilian Botzenstrasse 12 84561 Mehring-Öd / DE | 04 /
Pemwieser, Albert Mitterndorf 14 5122 Ach / AT | [1998/17] | Representative(s) | Rimböck, Karl-Heinz, et al Wacker-Chemie GmbH Zentralabteilung PML Hanns-Seidel-Platz 4 81737 München / DE | [N/P] |
| Former [1998/17] | Rimböck, Karl-Heinz, Dr., et al c/o Wacker-Chemie GmbH Zentralabteilung PML Hans-Seidel-Platz 4 81737 München / DE | Application number, filing date | 97117891.8 | 16.10.1997 | [1998/17] | Priority number, date | DE1996142908 | 17.10.1996 Original published format: DE 19642908 | [1998/17] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0837115 | Date: | 22.04.1998 | Language: | DE | [1998/17] | Type: | B1 Patent specification | No.: | EP0837115 | Date: | 05.01.2000 | Language: | DE | [2000/01] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.01.1998 | Classification | IPC: | C09K3/14 | [1998/17] | CPC: |
B28D1/025 (EP,US);
H01L21/78 (KR);
C09K3/1472 (EP,US)
| Designated contracting states | DE, GB, IT [1999/01] |
| Former [1998/17] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Verfahren zum Abtrennen von Scheiben von einem Kristall | [1999/11] | English: | Method for cutting wafers from a crystal | [1999/11] | French: | Procédé pour couper des plaquettes d'un cristal | [1999/11] |
| Former [1998/17] | Sägesuspension und Verfahren zum Abtrennen von Scheiben von einem Kristall | ||
| Former [1998/17] | Slicing slurry and method for cutting wafers from a crystal | ||
| Former [1998/17] | Suspension de sciage et procédé pour couper des plaquettes d'un cristal | Examination procedure | 16.10.1997 | Examination requested [1998/17] | 16.10.1997 | Request for accelerated examination filed | 01.04.1998 | Despatch of a communication from the examining division (Time limit: M06) | 01.04.1998 | Decision about request for accelerated examination - accepted: Yes | 03.09.1998 | Reply to a communication from the examining division | 01.10.1998 | Despatch of a communication from the examining division (Time limit: M04) | 14.01.1999 | Reply to a communication from the examining division | 17.03.1999 | Despatch of communication of intention to grant (Approval: Yes) | 12.07.1999 | Communication of intention to grant the patent | 16.09.1999 | Fee for grant paid | 16.09.1999 | Fee for publishing/printing paid | Opposition(s) | 06.10.2000 | No opposition filed within time limit [2000/51] | Fees paid | Renewal fee | 04.10.1999 | Renewal fee patent year 03 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DA]JPH04218594 ; | [A]JPS5721495 ; | [XA]US2980524 (MORTON JOHN S) [X] 1,2 * the whole document * [A] 3-5; | [XA]US3817727 (YANCEY P) [X] 1,2 * the whole document * [A] 3-5; | [DA]EP0686684 (BAYER AG [DE]) [DA] 1-5 * the whole document *; | [A]EP0733429 (WACKER SILTRONIC HALBLEITERMAT [DE]) [A] 1-5* the whole document *; | [DA] - DATABASE WPI, 1, Derwent World Patents Index, vol. 92, no. 38, Database accession no. 92-312572, XP002050861 & JPH04218594 A 19920810 (NIPPON STEEL CORP) [DA] 1-5 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19820527), vol. 006, no. 090, Database accession no. (C - 104), & JP57021495 A 19820204 (MITSUBISHI METAL CORP) [A] 1-5 * abstract * |