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Extract from the Register of European Patents

EP About this file: EP0807484

EP0807484 - Method and apparatus for drilling a hole in solid material by laser beam irradiation [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  26.01.2001
Database last updated on 31.08.2024
Most recent event   Tooltip26.01.2001Application deemed to be withdrawnpublished on 14.03.2001 [2001/11]
Applicant(s)For all designated states
BAE Systems PLC
P.O. Box 87
Warwick House
Farnborough Aerospace Centre
Farnborough
Hampshire GU14 6YU / GB
[N/P]
Former [2000/42]For all designated states
BAE SYSTEMS plc
Warwick House, P.O. Box 87, Farnborough Aerospace Centre
Farnborough, Hampshire GU14 6YU / GB
Former [1997/47]For all designated states
BRITISH AEROSPACE PUBLIC LIMITED COMPANY
Warwick House, P.O. Box 87, Farnborough Aerospace Centre
Farnborough, Hants. GU14 6YU / GB
Inventor(s)01 / Williams, Stewart Wynn, British Aerospace PLC
Sowerby Research Centre, P.O. Box 5
Filton, Bristol BS12 7QW / GB
[1997/47]
Representative(s)(deleted)
[2000/42]
Former [1997/47]Rooney, Paul Blaise, et al
British Aerospace plc, Company Headquarters, Corporate IPR Department, Lancaster House, P.O. Box 87, Farnborough Aerospace Centre
Farnborough, Hants. GU14 6YU / GB
Application number, filing date97201467.415.05.1997
[1997/47]
Priority number, dateGB1996001025816.05.1996         Original published format: GB 9610258
[1997/47]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0807484
Date:19.11.1997
Language:EN
[1997/47]
Search report(s)(Supplementary) European search report - dispatched on:EP28.08.1997
ClassificationIPC:B23K26/00, B23K26/06
[1997/47]
CPC:
B23K26/067 (EP); B23K26/0676 (EP); B23K26/382 (EP);
B23K26/40 (EP); B23K2103/14 (EP); B23K2103/50 (EP);
B23K2103/52 (EP) (-)
Designated contracting statesDE,   ES,   FR,   GB [1997/47]
TitleGerman:Verfahren und Vorrichtung zum Bohren eines Lochs in einem Feststoff mittels Laserstrahlung[1997/47]
English:Method and apparatus for drilling a hole in solid material by laser beam irradiation[1997/47]
French:Procédé et dispositif pour percer un trou dans un matériau solide par rayonnement laser[1997/47]
Examination procedure15.05.1998Examination requested  [1998/29]
28.02.2000Despatch of a communication from the examining division (Time limit: M04)
11.07.2000Application deemed to be withdrawn, date of legal effect  [2001/11]
25.09.2000Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2001/11]
Fees paidRenewal fee
25.05.1999Renewal fee patent year 03
17.04.2000Renewal fee patent year 04
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Documents cited:Search[X]WO8602301  (ADVANCED LASER SYSTEMS INC) [X] 1,5,10,11 * page 45 - page 51; examples 1,2; claim 1 *;
 [X]US5063280  (INAGAWA HIDEHO ET AL) [X] 1,5,6 * column 5, line 56 - column 6, line 49; figure 4 *;
 [X]US5055653  (FUNAMI KOJI ET AL) [X] 13-15,18 * column 2, line 18 - line 19; figures 6-9; examples 3,4 *;
 [X]EP0454152  (CANON KK) [X] 13 * column 1, line 56 - column 2, line 1; figures 1,4 * * column 3, line 44 - column 4, line 24 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.