blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP0836194

EP0836194 - Semiconductor device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.03.2001
Database last updated on 20.09.2024
Most recent event   Tooltip30.03.2001No opposition filed within time limitpublished on 16.05.2001 [2001/20]
Applicant(s)For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome Chiyoda-ku
Tokyo 100 / JP
[N/P]
Former [1998/16]For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome Chiyoda-ku
Tokyo 100 / JP
Inventor(s)01 / Yamaguchi, Yasuo, Mitsubishi Denki K.K. LSI
Kenkyusho, 1, Mizuhara, 4-chome
Itami-shi, Hyogo 664 / JP
02 / Nishimura, Tadashi, Mitsubishi Denki K.K. LSI
Kenkyusho, 1, Mizuhara, 4-chome
Itami-shi, Hyogo 664 / JP
[1998/16]
Representative(s)Beresford, Keith Denis Lewis, et al
Beresford Crump LLP
16 High Holborn
London WC1V 6BX / GB
[N/P]
Former [1998/16]Beresford, Keith Denis Lewis, et al
BERESFORD & Co. 2-5 Warwick Court High Holborn
London WC1R 5DJ / GB
Application number, filing date97203535.629.03.1993
[1998/16]
Priority number, dateJP1992007418430.03.1992         Original published format: JP 7418492
[1998/16]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0836194
Date:15.04.1998
Language:EN
[1998/16]
Type: A3 Search report 
No.:EP0836194
Date:10.03.1999
[1999/10]
Type: B1 Patent specification 
No.:EP0836194
Date:24.05.2000
Language:EN
[2000/21]
Search report(s)(Supplementary) European search report - dispatched on:EP25.01.1999
ClassificationIPC:G11C5/14, G11C11/407, H01L27/12
[1999/10]
CPC:
H03K19/0016 (EP,US); G11C11/4074 (EP,US); G11C5/146 (EP,US);
H01L27/0218 (EP,US); H01L27/105 (EP,US)
Former IPC [1998/16]G11C5/14, G11C11/407
Designated contracting statesDE,   FR,   GB [1998/16]
TitleGerman:Halbleiteranordnung[1998/16]
English:Semiconductor device[1998/16]
French:Dispositif à semi-conducteurs[1998/16]
Examination procedure05.03.1999Examination requested  [1999/19]
23.09.1999Despatch of communication of intention to grant (Approval: Yes)
11.11.1999Communication of intention to grant the patent
13.01.2000Fee for grant paid
13.01.2000Fee for publishing/printing paid
Parent application(s)   TooltipEP93302415.0  / EP0564204
Opposition(s)27.02.2001No opposition filed within time limit [2001/20]
Fees paidRenewal fee
26.11.1997Renewal fee patent year 03
26.11.1997Renewal fee patent year 04
26.11.1997Renewal fee patent year 05
18.03.1998Renewal fee patent year 06
19.03.1999Renewal fee patent year 07
20.03.2000Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[PA]JPH04359470  ;
 [A]EP0118108  (NEC CORP [JP]);
 [A]US4837460  (UCHIDA YUKIMASA [JP]);
 [A]EP0473397  (SHARP KK [JP])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.