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EP0867938

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Extract from the Register of European Patents

EP About this file: EP0867938

EP0867938 - Semiconductor device comprising electrode pads and leads [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 29.08.2014 Database last updated on 20.09.2024
Most recent event Tooltip	29.08.2014	Application deemed to be withdrawn	published on 01.10.2014 [2014/40]
Applicant(s)	For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP
	[N/P]
Former [1998/40]	For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP
Inventor(s)	01 / Uchida, Yasufumi c/o Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome, Minato-ku Tokyo / JP
	[1998/40]
Representative(s)	Read, Matthew Charles, et al Venner Shipley LLP 200 Aldersgate London EC1A 4HD / GB
	[N/P]
Former [1998/40]	Read, Matthew Charles, et al Venner Shipley & Co. 20 Little Britain London EC1A 7DH / GB
Application number, filing date	97308718.2	30.10.1997
	[1998/40]
Priority number, date	JP19970076780	28.03.1997 Original published format: JP 7678097
	[1998/40]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0867938
	Date:	30.09.1998
	Language:	EN
	[1998/40]
	Type:	A3 Search report
	No.:	EP0867938
	Date:	10.03.1999
	[1999/10]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	21.01.1999
Classification	IPC:	H01L23/495	[1998/40]
	CPC:	H01L24/48 (EP,US); H01L21/60 (KR); H01L23/4951 (EP,US); H01L24/03 (EP,US); H01L24/05 (EP,US); H01L24/06 (EP,US); (+) H01L24/49 (EP,US); H01L24/78 (EP,US); H01L24/85 (EP,US); H01L2224/02166 (EP,US); H01L2224/023 (EP); H01L2224/0401 (EP,US); H01L2224/04042 (EP,US); H01L2224/05554 (EP,US); H01L2224/05556 (EP,US); H01L2224/05599 (EP,US); H01L2224/45124 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US); H01L2224/4826 (EP,US); H01L2224/48465 (EP,US); H01L2224/48699 (EP,US); H01L2224/4899 (EP,US); H01L2224/49171 (EP,US); H01L2224/49175 (EP,US); H01L2224/78 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01019 (EP,US); H01L2924/01021 (EP,US); H01L2924/01029 (EP,US); H01L2924/01074 (EP,US); H01L2924/014 (EP,US); H01L2924/07802 (EP,US); H01L2924/181 (EP,US) (-)
	C-Set:	H01L2224/023, H01L2924/0001 (EP); H01L2224/45124, H01L2924/00 (US,EP); H01L2224/48091, H01L2924/00014 (US,EP); H01L2224/4826, H01L2224/48465, H01L2924/00 (EP,US); (+) H01L2224/4826, H01L2224/49171, H01L2924/00 (EP,US); H01L2224/4826, H01L2224/49175, H01L2924/00 (EP,US); H01L2224/48465, H01L2224/48091, H01L2924/00 (US,EP); H01L2224/48465, H01L2224/48247, H01L2924/00 (EP,US); H01L2224/48465, H01L2224/48247, H01L2924/00012 (US,EP); H01L2224/48465, H01L2224/4826, H01L2924/00 (US,EP); H01L2224/48699, H01L2924/00 (US,EP); H01L2224/49171, H01L2224/48247, H01L2924/00 (US,EP); H01L2224/49171, H01L2224/48465, H01L2924/00 (US,EP); H01L2224/49175, H01L2224/48247, H01L2924/00 (US,EP); H01L2224/49175, H01L2224/48465, H01L2924/00 (US,EP); H01L2924/00014, H01L2224/05556 (EP,US); H01L2924/00014, H01L2224/05599, H01L2924/00 (US,EP); H01L2924/00014, H01L2224/45099 (EP,US); H01L2924/00014, H01L2224/45099, H01L2924/00 (US,EP); H01L2924/00014, H01L2224/85399 (US,EP); H01L2924/07802, H01L2924/00 (EP,US); H01L2924/181, H01L2924/00012 (US,EP) (-)
Designated contracting states	DE, FR, GB, IT, NL [1999/50]
Former [1999/47]	AT, BE, CH, DE, DK, LI
Former [1998/40]	AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE
Title	German:	Halbleiteranordnung mit Elektrodenflächen und Leiter	[1998/40]
	English:	Semiconductor device comprising electrode pads and leads	[1998/40]
	French:	Dispositif semiconducteur comprenant des plages d'électrodes et des conducteurs	[1998/40]
Examination procedure	30.08.1999	Examination requested [1999/43]
	11.09.1999	Loss of particular rights, legal effect: designated state(s)
	20.01.2000	Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, DK, ES, FI, GR, IE, LI, LU, MC, PT, SE
	13.11.2003	Despatch of a communication from the examining division (Time limit: M04)
	22.03.2004	Reply to a communication from the examining division
	08.07.2008	Despatch of a communication from the examining division (Time limit: M04)
	31.10.2008	Reply to a communication from the examining division
	01.05.2014	Application deemed to be withdrawn, date of legal effect [2014/40]
	26.05.2014	Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2014/40]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 13.11.2003
Fees paid	Renewal fee
	22.10.1999	Renewal fee patent year 03
	20.10.2000	Renewal fee patent year 04
	19.10.2001	Renewal fee patent year 05
	29.10.2002	Renewal fee patent year 06
	17.10.2003	Renewal fee patent year 07
	22.10.2004	Renewal fee patent year 08
	18.10.2005	Renewal fee patent year 09
	18.10.2006	Renewal fee patent year 10
	17.10.2007	Renewal fee patent year 11
	20.10.2008	Renewal fee patent year 12
	20.10.2009	Renewal fee patent year 13
	19.10.2010	Renewal fee patent year 14
	20.10.2011	Renewal fee patent year 15
	19.10.2012	Renewal fee patent year 16
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	08.11.1999	AT M01 Not yet paid
	08.11.1999	BE M01 Not yet paid
	08.11.1999	CH M01 Not yet paid
	08.11.1999	DK M01 Not yet paid
	08.11.1999	ES M01 Not yet paid
	08.11.1999	FI M01 Not yet paid
	08.11.1999	GR M01 Not yet paid
	08.11.1999	IE M01 Not yet paid
	08.11.1999	LU M01 Not yet paid
	08.11.1999	MC M01 Not yet paid
	08.11.1999	PT M01 Not yet paid
	08.11.1999	SE M01 Not yet paid
	Additional fee for renewal fee
	31.10.2013	17 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XA]US5252854 (ARITA JUNICHI [JP], et al) [X] 1,2,4,14 * column 3, line 65 - column 4, line 54; figures 1,2,6,7B * * column 7, line 46 - column 8, line 29 * [A] 11-13;
		[XA]JPH06283659 ;
		[A]JPH05114622 ;
		[XA]US5319241 (LIM THIAM B [SG]) [X] 1,2,4,14 * column 4, line 11 - column 5, line 28; figures 3,4 * [A] 11-13
		[XA] - PATENT ABSTRACTS OF JAPAN, (19950228), vol. 095, no. 001, & JP06283659 A 19941007 (MITSUBISHI ELECTRIC CORP) [X] 1,2,14 * abstract * [A] 11-13
		[A] - PATENT ABSTRACTS OF JAPAN, (19930830), vol. 017, no. 476, Database accession no. (E - 1424), & JP05114622 A 19930507 (HITACHI LTD;OTHERS: 01) [A] 1,11-14 * the whole document *
	by applicant	US5252854
		US5319241
		JPH06286659

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