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EP0956590
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EP About this file: EP0956590
| EP0956590 - CONFORMAL THERMAL INTERFACE MATERIAL FOR ELECTRONIC COMPONENTS [Right-click to bookmark this link] | Status | The application has been refused Status updated on 21.05.2004 Database last updated on 31.08.2024 | Most recent event Tooltip | 21.05.2004 | Refusal of application | published on 07.07.2004 [2004/28] | Applicant(s) | For all designated states PARKER-HANNIFIN CORPORATION 17325 Euclid Avenue Cleveland, Ohio 44112 / US | [1999/46] | Inventor(s) | 01 /
BUNYAN, Michael, H. 21 Essex Place Chelmsford, MA 01824 / US | 02 /
de SORGO, Miksa 3 Shamrock Road Windham, NH 33087 / US | [1999/46] | Representative(s) | Pilch, Adam John Michael, et al D Young & Co 120 Holborn London EC1N 2DY / GB | [N/P] |
| Former [2002/24] | Pilch, Adam John Michael, et al D. YOUNG & CO., 21 New Fetter Lane London EC4A 1DA / GB | ||
| Former [2000/26] | Boden, Keith McMurray, et al D. Young & Co. 21 New Fetter Lane London EC4A 1DA / GB | ||
| Former [1999/46] | Purvis, William Michael Cameron, et al D. Young & Co., 21 New Fetter Lane London EC4A 1DA / GB | Application number, filing date | 97903552.4 | 14.02.1997 | [1999/46] | WO1997IB00223 | Priority number, date | US19960016488P | 29.04.1996 Original published format: US 16488 P | [1999/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO9741599 | Date: | 06.11.1997 | Language: | EN | [1997/47] | Type: | A1 Application with search report | No.: | EP0956590 | Date: | 17.11.1999 | Language: | EN | The application published by WIPO in one of the EPO official languages on 06.11.1997 takes the place of the publication of the European patent application. | [1999/46] | Search report(s) | International search report - published on: | EP | 06.11.1997 | Classification | IPC: | H01L23/373, C09K5/06 | [1999/46] | CPC: |
H01L23/3737 (EP,US);
C09K5/06 (EP,US);
H01L2224/32245 (EP,US);
H01L2924/3011 (EP,US);
Y10T428/1419 (EP,US);
Y10T428/1452 (EP,US);
Y10T428/1476 (EP,US);
Y10T428/2822 (EP,US);
Y10T428/2826 (EP,US);
Y10T428/31909 (EP,US)
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| Designated contracting states | BE, DE, DK, ES, FI, FR, GB, IE, IT, SE [1999/46] | Title | German: | ANPASSUNGSFÄHIGES THERMISCHES ZWISCHENLAGEMATERIAL FÜR ELEKTRONISCHEN KOMPONENTEN | [1999/46] | English: | CONFORMAL THERMAL INTERFACE MATERIAL FOR ELECTRONIC COMPONENTS | [1999/46] | French: | MATERIAU D'INTERFACE THERMIQUE CONFORME POUR COMPOSANTS ELECTRONIQUES | [1999/46] | Entry into regional phase | 23.10.1998 | National basic fee paid | 23.10.1998 | Designation fee(s) paid | 23.10.1998 | Examination fee paid | Examination procedure | 03.11.1997 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 23.10.1998 | Examination requested [1999/46] | 27.07.2001 | Despatch of a communication from the examining division (Time limit: M06) | 14.01.2002 | Reply to a communication from the examining division | 16.01.2004 | Despatch of communication that the application is refused, reason: substantive examination [2004/28] | 26.01.2004 | Application refused, date of legal effect [2004/28] | Fees paid | Renewal fee | 11.02.1999 | Renewal fee patent year 03 | 02.02.2000 | Renewal fee patent year 04 | 07.02.2001 | Renewal fee patent year 05 | 05.02.2002 | Renewal fee patent year 06 | 10.02.2003 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 29.02.2004 | 08 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [DA]US4473113 (WHITFIELD FRED J [US], et al) [DA] 1,5-8,11,13,16,17,20 * column 3, line 63 - column 10, line 15; figures 1-15 *; | [A]US4487856 (ANDERSON ALBERT G [US], et al) [A] 1,5,11,13,16,20 * column 6, line 51 - column 7, line 16; claims 1,2,4 *; | [A] - R.H.LACOMBE ET AL., "Flexible heat-conducting sheet material for semiconductor packages", IBM TECHNICAL DISCLOSURE BULLETIN, NEW YORK, US, (198304), vol. 25, no. 11A, pages 5740 - 5743, XP002033449 [A] 1,7,8,13 * the whole document * | [A] - "INTERFACE MATERIALS OFFER HEAT TRANSFER AND ISOLATION", ELECTRONIC PACKAGING AND PRODUCTION, (19950901), vol. 35, no. 10, page 32, XP000532276 [A] 1,5,7,13,16 * the whole document * | [A] - J.K.HASSAN ET AL., "Chip cooling employing alloys having different solidus temperatures", IBM TECHNICAL DISCLOSURE BULLETIN, NEW YORK, US, (198205), vol. 24, no. 12, pages 6437 - 6438, XP002033450 [A] 1,7,13 * the whole document * | [A] - "THERMALLY CONDUCTIVE, REWORKABLE, ELASTOMERIC INTERPOSER FOR CHIP- TO-HEAT SINK ATTACHMENT", IBM TECHNICAL DISCLOSURE BULLETIN, (19921201), vol. 35, no. 7, pages 241 - 242, XP000332996 [A] 1,2,7,13 * the whole document * | [A] - D.PAL ET AL., "Application of phase change materials to thermal control of electronic modules: a computational study", ADVANCES IN ELECTRONIC PACKAGING 1995. PROCEEDINGS OF THE INTERNATIONAL INTERSOCIETY ELECTRONIC PACKAGING CONFERENCE - INTERPACK '95, NEW YORK, NY, USA, (1995), vol. 2, pages 1307 - 1315, XP000675945 [A] 1,13 * page 1307 - page 1309, column L, paragraph 1 * |