-
EP0907965
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP0907965
| EP0907965 - COMPONENT HOUSING FOR SURFACE MOUNTING A SEMICONDUCTOR COMPONENT [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 14.06.2002 Database last updated on 06.11.2024 | Most recent event Tooltip | 14.06.2002 | Application deemed to be withdrawn | published on 31.07.2002 [2002/31] | Applicant(s) | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | [N/P] |
| Former [2001/01] | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81541 München / DE | ||
| Former [1999/15] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | Inventor(s) | 01 /
WINTERER, Jürgen Brünndles Weg 4 D-90451 Nürnberg / DE | 02 /
BEER, Gottfried Hochrainstrasse 8 D-93152 Nittendorf / DE | 03 /
STADLER, Bernd Gregor-Mendel-Strasse 8 D-93093 Donaustauf / DE | [1999/15] | Representative(s) | Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE | [N/P] |
| Former [2001/03] | Zimmermann & Partner Postfach 33 09 20 80069 München / DE | ||
| Former [2001/01] | Zedlitz, Peter, Dipl.-Inf., et al Patentanwalt, Postfach 22 13 17 80503 München / DE | Application number, filing date | 97931678.3 | 27.06.1997 | [1999/15] | WO1997DE01358 | Priority number, date | DE1996126082 | 28.06.1996 Original published format: DE 19626082 | DE1996126098 | 28.06.1996 Original published format: DE 19626098 | [1999/15] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO9800864 | Date: | 08.01.1998 | Language: | DE | [1998/01] | Type: | A1 Application with search report | No.: | EP0907965 | Date: | 14.04.1999 | Language: | DE | The application published by WIPO in one of the EPO official languages on 08.01.1998 takes the place of the publication of the European patent application. | [1999/15] | Search report(s) | International search report - published on: | EP | 08.01.1998 | Classification | IPC: | H01L23/13 | [1999/15] | CPC: |
H01L23/047 (EP,US);
H01L23/13 (EP,US);
H01L23/24 (EP,US);
H01L23/3107 (EP,US);
H01L23/49861 (EP,US);
H05K3/303 (EP,US);
H01L2224/05554 (EP,US);
H01L2224/056 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/48465 (EP,US);
H01L2224/49175 (EP,US);
H01L24/48 (EP,US);
H01L24/49 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/10161 (EP,US);
H01L2924/15153 (EP,US);
H01L2924/15165 (EP,US);
H01L2924/16195 (EP,US);
H01L2924/181 (EP,US);
H05K1/181 (EP,US);
H05K2201/09036 (EP,US);
H05K2201/10568 (EP,US);
H05K2201/10689 (EP,US);
| C-Set: |
H01L2224/056, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP,US);
H01L2224/48465, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/49175, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/49175, H01L2224/48465, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US); | Designated contracting states | DE, FR, GB, IT [1999/15] | Title | German: | BAUELEMENTGEHÄUSE FÜR EINE OBERFLÄCHENMONTAGE EINES HALBLEITER-BAUELEMENTES | [1999/15] | English: | COMPONENT HOUSING FOR SURFACE MOUNTING A SEMICONDUCTOR COMPONENT | [1999/15] | French: | BOITIER DE COMPOSANT POUR MONTER EN SURFACE UN COMPOSANT A SEMICONDUCTEUR | [1999/15] | Entry into regional phase | 17.12.1998 | National basic fee paid | 17.12.1998 | Designation fee(s) paid | 17.12.1998 | Examination fee paid | Examination procedure | 05.11.1997 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 17.12.1998 | Examination requested [1999/15] | 31.10.2000 | Despatch of a communication from the examining division (Time limit: M04) | 09.03.2001 | Reply to a communication from the examining division | 14.09.2001 | Despatch of communication of intention to grant (Approval: Yes) | 09.10.2001 | Communication of intention to grant the patent | 22.01.2002 | Application deemed to be withdrawn, date of legal effect [2002/31] | 01.03.2002 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2002/31] | Fees paid | Renewal fee | 18.06.1999 | Renewal fee patent year 03 | 19.06.2000 | Renewal fee patent year 04 | 28.06.2001 | Renewal fee patent year 05 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [Y]EP0409257 (TOSHIBA KK [JP]) [Y] 1 * column 8, line 1 - line 19; figures 6,7 *; | [A]JPS60224263 | [YA] - "high density chip carrier with protected leads", IBM TECHNICAL DISCLOSURE BULLETIN, NEW YORK, (198807), vol. 31, no. 2, pages 238 - 239, XP002043128 [Y] 1 * the whole document * [A] 4,8 | [A] - PATENT ABSTRACTS OF JAPAN, (19860328), vol. 010, no. 079, Database accession no. (E - 391), & JP60224263 A 19851108 (OKI DENKI KOGYO KK) [A] * abstract * |