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EP0887105
European procedure
Extract from the Register of European Patents
EP About this file: EP0887105
| EP0887105 - Device and method for comminution of semiconductive material [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.07.2002 Database last updated on 18.10.2024 | Most recent event Tooltip | 13.07.2002 | No opposition filed within time limit | published on 28.08.2002 [2002/35] | Applicant(s) | For all designated states Wacker-Chemie GmbH Hanns-Seidel-Platz 4 81737 München / DE | [1999/01] | Inventor(s) | 01 /
Köppl, Franz, Dr. Spielberg 40 84567 Erlbach / DE | 02 /
Fuchs, Paul Oberlindach 69 5230 Mattighofen / AT | [1999/01] | Representative(s) | Potten, Holger Wacker Chemie AG Zentralbereich Patente, Marken und Lizenzen Hanns-Seidel-Platz 4 81737 München / DE | [N/P] |
| Former [1999/01] | Potten, Holger Wacker-Chemie GmbH Zentralabteilung Patente, Marken und Lizenzen Hanns-Seidel-Platz 4 81737 München / DE | Application number, filing date | 98110151.2 | 04.06.1998 | [1999/01] | Priority number, date | DE1997127441 | 27.06.1997 Original published format: DE 19727441 | [1999/01] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0887105 | Date: | 30.12.1998 | Language: | DE | [1998/53] | Type: | B1 Patent specification | No.: | EP0887105 | Date: | 05.09.2001 | Language: | DE | [2001/36] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.10.1998 | Classification | IPC: | B02C19/18, B02C19/12, B23H9/00, B28D5/00 | [1999/01] | CPC: |
B28D5/00 (EP,US);
B02C19/18 (EP,KR,US);
B02C19/0056 (EP,US);
B02C2019/183 (EP,KR,US)
| Designated contracting states | DE, IT [1999/36] |
| Former [1999/01] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Vorrichtung und Verfahren zum Zerkleinern von Halbleitermaterial | [1999/01] | English: | Device and method for comminution of semiconductive material | [1999/01] | French: | Dispositif et procédé de fragmentation de matériaux semiconducteur | [1999/01] | Examination procedure | 05.06.1998 | Examination requested [1998/53] | 06.03.2001 | Despatch of communication of intention to grant (Approval: Yes) | 23.04.2001 | Communication of intention to grant the patent | 05.07.2001 | Fee for grant paid | 05.07.2001 | Fee for publishing/printing paid | Opposition(s) | 06.06.2002 | No opposition filed within time limit [2002/35] | Fees paid | Renewal fee | 23.05.2000 | Renewal fee patent year 03 | 23.05.2001 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US5464159 (WOLF ANDREAS [DE], et al) [A] 1,3 * column 2, line 14 - line 43 * * column 3, line 19 - line 23 *; | [A]US4540127 (ANDRES URI [GB]) [A] 1,3 * column 4, line 1 - line 20 * * figure . *; | [A]US4653697 (CODINA GEORGE [US]) [A] 1,3 * abstract * * figure 1 *; | [DA]US4871117 (BAUEREGGER ROLF [DE], et al) [DA] 1,3 * abstract * |