EP0867935 - Plastic package and semiconductor device [Right-click to bookmark this link] | |||
Former [1998/40] | Plastic package, semiconductor device, and method of manufacturing plastic package | ||
[2008/07] | Status | No opposition filed within time limit Status updated on 22.05.2009 Database last updated on 02.11.2024 | Most recent event Tooltip | 11.06.2010 | Lapse of the patent in a contracting state | published on 14.07.2010 [2010/28] | Applicant(s) | For all designated states Mitsui Chemicals, Inc. 5-2, Higashi-Shimbashi 1-Chome Minato-ku Tokyo / JP | [2008/29] |
Former [2004/49] | For all designated states MITSUI CHEMICALS, INC. 5-2, Higashi-Shimbashi 1-Chome Minato-ku Tokyo / JP | ||
Former [1998/40] | For all designated states MITSUI CHEMICALS, INC. 2-5, Kasumigaseki 3-chome, Chiyoda-ku Tokyo / JP | Inventor(s) | 01 /
Haruta, Koichi, c/o Mitsui Chemicals Inc. 1-2, Waki 6-chome, Waki-cho Kuga-gun, Yamaguchi-ken / JP | [1998/40] | Representative(s) | Price, Nigel John King, et al J A Kemp 14 South Square Gray's Inn London WC1R 5JJ / GB | [N/P] |
Former [2008/29] | Price, Nigel John King, et al J.A. KEMP & CO. 14 South Square Gray's Inn London WC1R 5JJ / GB | ||
Former [2008/10] | Price, Nigel John King, et al J.A. Kemp & Co. 14 South Square Gray's Inn London WC1R 5JJ / GB | ||
Former [1998/40] | Senior, Alan Murray J.A. KEMP & CO., 14 South Square, Gray's Inn London WC1R 5LX / GB | Application number, filing date | 98302290.6 | 25.03.1998 | [1998/40] | Priority number, date | JP19970071837 | 25.03.1997 Original published format: JP 7183797 | [1998/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0867935 | Date: | 30.09.1998 | Language: | EN | [1998/40] | Type: | A3 Search report | No.: | EP0867935 | Date: | 15.03.2000 | [2000/11] | Type: | B1 Patent specification | No.: | EP0867935 | Date: | 16.07.2008 | Language: | EN | [2008/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.01.2000 | Classification | IPC: | H01L23/10, H01L23/00, H01L23/495 | [2000/10] | CPC: |
H01L23/10 (EP,US);
H01L23/28 (KR);
H01L23/49548 (EP,US);
H01L23/49586 (EP,US);
H01L23/564 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01012 (EP,US);
H01L2924/01019 (EP,US);
H01L2924/01039 (EP,US);
H01L2924/12042 (EP,US);
H01L2924/16195 (EP,US);
H01L2924/181 (EP,US);
H01L2924/3025 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (EP,US);
H01L2924/12042, H01L2924/00 (US,EP); |
Former IPC [1998/40] | H01L23/10, H01L23/00 | Designated contracting states | DE, FR, GB, IT, NL [2000/47] |
Former [1998/40] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Kunststoffpackung und Halbleiteranordnung | [2008/07] | English: | Plastic package and semiconductor device | [2008/07] | French: | Empaquetage en plastique et dispositif semiconducteur | [2008/07] |
Former [1998/40] | Kunststoffpackung, Halbleiteranordnung, und Verfahren zum Herstellen einer Kunststoffpackung | ||
Former [1998/40] | Plastic package, semiconductor device, and method of manufacturing plastic package | ||
Former [1998/40] | Empaquetage en plastique, dispositif semiconducteur, et procédé pour fabriquer un empaquetage en plastique | Examination procedure | 20.07.2000 | Examination requested [2000/37] | 08.07.2004 | Despatch of a communication from the examining division (Time limit: M06) | 24.12.2004 | Reply to a communication from the examining division | 07.02.2008 | Communication of intention to grant the patent | 26.05.2008 | Fee for grant paid | 26.05.2008 | Fee for publishing/printing paid | Opposition(s) | 17.04.2009 | No opposition filed within time limit [2009/26] | Fees paid | Renewal fee | 13.03.2000 | Renewal fee patent year 03 | 16.03.2001 | Renewal fee patent year 04 | 13.03.2002 | Renewal fee patent year 05 | 11.03.2003 | Renewal fee patent year 06 | 15.03.2004 | Renewal fee patent year 07 | 14.03.2005 | Renewal fee patent year 08 | 09.03.2006 | Renewal fee patent year 09 | 14.03.2007 | Renewal fee patent year 10 | 14.03.2008 | Renewal fee patent year 11 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 25.03.2009 | [2010/28] | Documents cited: | Search | [XA]JPS61152053 ; | [XA]US4767049 (BUTT SHELDON H [US], et al) [X] 1,2,10,11,17,18 * the whole document * [A] 3,4,19; | [XA]JPS59219949 ; | [XA]JPS6060742 ; | [XA]EP0478241 (TEXAS INSTRUMENTS INC [US]) [X] 1,2,18 * the whole document * [A] 17; | [X]JPS63177543 ; | [AD]JPH0855927 ; | [A]JPS60231349 ; | [A]JPS6139556 | [XA] - PATENT ABSTRACTS OF JAPAN, (19861127), vol. 010, no. 352, Database accession no. (E - 458), & JP61152053 A 19860710 (HITACHI LTD;OTHERS: 01) [X] 1,2,10,11,17,18 * abstract * [A] 3 | [XA] - PATENT ABSTRACTS OF JAPAN, (19850418), vol. 009, no. 089, Database accession no. (E - 309), & JP59219949 A 19841211 (SUMITOMO DENKI KOGYO KK) [X] 1,18 * abstract * [A] 2,11,17 | [XA] - PATENT ABSTRACTS OF JAPAN, (19850809), vol. 009, no. 193, Database accession no. (E - 334), & JP60060742 A 19850408 (MATSUSHITA DENSHI KOGYO KK) [X] 1,10,18 * abstract * [A] 17 | [X] - PATENT ABSTRACTS OF JAPAN, (19881125), vol. 012, no. 449, Database accession no. (E - 686), & JP63177543 A 19880721 (NEC CORP) [X] 1,17,18 * abstract * | [AD] - PATENT ABSTRACTS OF JAPAN, (19960628), vol. 1996, no. 06, & JP08055927 A 19960227 (MITSUI PETROCHEM IND LTD) [AD] 1,3,17,18 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19860405), vol. 010, no. 087, Database accession no. (E - 393), & JP60231349 A 19851116 (TOSHIBA KK) [A] 3,4,18 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19860705), vol. 010, no. 192, Database accession no. (E - 417), & JP61039556 A 19860225 (TOSHIBA CORP) [A] 3,18 * abstract * | Examination | JPS63169747 | JPH06148951 | JPH07326699 | JPS63310146 | - PATENT ABSTRACTS OF JAPAN, (19981116), vol. 12, no. 435, Database accession no. (E - 683), & JP63169747 A 19980713 (MITSUBISHI ELECTRIC CORP.) | - PATENT ABSTRACTS OF JAPAN, (19860722), vol. 10, no. 209, Database accession no. (E - 421)<2265> , & JP6148951 A 19860310 (TOSHIBA CORP) |