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Extract from the Register of European Patents

EP About this file: EP0867935

EP0867935 - Plastic package and semiconductor device [Right-click to bookmark this link]
Former [1998/40]Plastic package, semiconductor device, and method of manufacturing plastic package
[2008/07]
StatusNo opposition filed within time limit
Status updated on  22.05.2009
Database last updated on 02.11.2024
Most recent event   Tooltip11.06.2010Lapse of the patent in a contracting statepublished on 14.07.2010  [2010/28]
Applicant(s)For all designated states
Mitsui Chemicals, Inc.
5-2, Higashi-Shimbashi 1-Chome Minato-ku
Tokyo / JP
[2008/29]
Former [2004/49]For all designated states
MITSUI CHEMICALS, INC.
5-2, Higashi-Shimbashi 1-Chome Minato-ku
Tokyo / JP
Former [1998/40]For all designated states
MITSUI CHEMICALS, INC.
2-5, Kasumigaseki 3-chome, Chiyoda-ku
Tokyo / JP
Inventor(s)01 / Haruta, Koichi, c/o Mitsui Chemicals Inc.
1-2, Waki 6-chome, Waki-cho
Kuga-gun, Yamaguchi-ken / JP
[1998/40]
Representative(s)Price, Nigel John King, et al
J A Kemp
14 South Square
Gray's Inn
London WC1R 5JJ / GB
[N/P]
Former [2008/29]Price, Nigel John King, et al
J.A. KEMP & CO. 14 South Square Gray's Inn London
WC1R 5JJ / GB
Former [2008/10]Price, Nigel John King, et al
J.A. Kemp & Co. 14 South Square Gray's Inn
London WC1R 5JJ / GB
Former [1998/40]Senior, Alan Murray
J.A. KEMP & CO., 14 South Square, Gray's Inn
London WC1R 5LX / GB
Application number, filing date98302290.625.03.1998
[1998/40]
Priority number, dateJP1997007183725.03.1997         Original published format: JP 7183797
[1998/40]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0867935
Date:30.09.1998
Language:EN
[1998/40]
Type: A3 Search report 
No.:EP0867935
Date:15.03.2000
[2000/11]
Type: B1 Patent specification 
No.:EP0867935
Date:16.07.2008
Language:EN
[2008/29]
Search report(s)(Supplementary) European search report - dispatched on:EP28.01.2000
ClassificationIPC:H01L23/10, H01L23/00, H01L23/495
[2000/10]
CPC:
H01L23/10 (EP,US); H01L23/28 (KR); H01L23/49548 (EP,US);
H01L23/49586 (EP,US); H01L23/564 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/01012 (EP,US); H01L2924/01019 (EP,US); H01L2924/01039 (EP,US);
H01L2924/12042 (EP,US); H01L2924/16195 (EP,US); H01L2924/181 (EP,US);
H01L2924/3025 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (EP,US);
H01L2924/12042, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00 (EP,US)
(-)
Former IPC [1998/40]H01L23/10, H01L23/00
Designated contracting statesDE,   FR,   GB,   IT,   NL [2000/47]
Former [1998/40]AT,  BE,  CH,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Kunststoffpackung und Halbleiteranordnung[2008/07]
English:Plastic package and semiconductor device[2008/07]
French:Empaquetage en plastique et dispositif semiconducteur[2008/07]
Former [1998/40]Kunststoffpackung, Halbleiteranordnung, und Verfahren zum Herstellen einer Kunststoffpackung
Former [1998/40]Plastic package, semiconductor device, and method of manufacturing plastic package
Former [1998/40]Empaquetage en plastique, dispositif semiconducteur, et procédé pour fabriquer un empaquetage en plastique
Examination procedure20.07.2000Examination requested  [2000/37]
08.07.2004Despatch of a communication from the examining division (Time limit: M06)
24.12.2004Reply to a communication from the examining division
07.02.2008Communication of intention to grant the patent
26.05.2008Fee for grant paid
26.05.2008Fee for publishing/printing paid
Opposition(s)17.04.2009No opposition filed within time limit [2009/26]
Fees paidRenewal fee
13.03.2000Renewal fee patent year 03
16.03.2001Renewal fee patent year 04
13.03.2002Renewal fee patent year 05
11.03.2003Renewal fee patent year 06
15.03.2004Renewal fee patent year 07
14.03.2005Renewal fee patent year 08
09.03.2006Renewal fee patent year 09
14.03.2007Renewal fee patent year 10
14.03.2008Renewal fee patent year 11
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipGB25.03.2009
[2010/28]
Documents cited:Search[XA]JPS61152053  ;
 [XA]US4767049  (BUTT SHELDON H [US], et al) [X] 1,2,10,11,17,18 * the whole document * [A] 3,4,19;
 [XA]JPS59219949  ;
 [XA]JPS6060742  ;
 [XA]EP0478241  (TEXAS INSTRUMENTS INC [US]) [X] 1,2,18 * the whole document * [A] 17;
 [X]JPS63177543  ;
 [AD]JPH0855927  ;
 [A]JPS60231349  ;
 [A]JPS6139556
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19861127), vol. 010, no. 352, Database accession no. (E - 458), & JP61152053 A 19860710 (HITACHI LTD;OTHERS: 01) [X] 1,2,10,11,17,18 * abstract * [A] 3
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19850418), vol. 009, no. 089, Database accession no. (E - 309), & JP59219949 A 19841211 (SUMITOMO DENKI KOGYO KK) [X] 1,18 * abstract * [A] 2,11,17
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19850809), vol. 009, no. 193, Database accession no. (E - 334), & JP60060742 A 19850408 (MATSUSHITA DENSHI KOGYO KK) [X] 1,10,18 * abstract * [A] 17
 [X]  - PATENT ABSTRACTS OF JAPAN, (19881125), vol. 012, no. 449, Database accession no. (E - 686), & JP63177543 A 19880721 (NEC CORP) [X] 1,17,18 * abstract *
 [AD]  - PATENT ABSTRACTS OF JAPAN, (19960628), vol. 1996, no. 06, & JP08055927 A 19960227 (MITSUI PETROCHEM IND LTD) [AD] 1,3,17,18 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19860405), vol. 010, no. 087, Database accession no. (E - 393), & JP60231349 A 19851116 (TOSHIBA KK) [A] 3,4,18 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19860705), vol. 010, no. 192, Database accession no. (E - 417), & JP61039556 A 19860225 (TOSHIBA CORP) [A] 3,18 * abstract *
ExaminationJPS63169747
 JPH06148951
 JPH07326699
 JPS63310146
    - PATENT ABSTRACTS OF JAPAN, (19981116), vol. 12, no. 435, Database accession no. (E - 683), & JP63169747 A 19980713 (MITSUBISHI ELECTRIC CORP.)
    - PATENT ABSTRACTS OF JAPAN, (19860722), vol. 10, no. 209, Database accession no. (E - 421)<2265> , & JP6148951 A 19860310 (TOSHIBA CORP)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.