Deutsch English Français

Contact

EP0889524

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...

Extract from the Register of European Patents

EP About this file: EP0889524

EP0889524 - Scalable and modular heat sink-heat pipe cooling system [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 11.01.2008 Database last updated on 18.11.2024
Most recent event Tooltip	11.01.2008	Application deemed to be withdrawn	published on 13.02.2008 [2008/07]
Applicant(s)	For all designated states SUN MICROSYSTEMS, INC. 4150 Network Circle Santa Clara, California 95054 / US
	[N/P]
Former [2003/17]	For all designated states Sun Microsystems, Inc. 4150 Network Circle Santa Clara, California 95054 / US
Former [1999/01]	For all designated states Sun Microsystems, Inc. 901 San Antonio Road Palo Alto, California 94303-4900 / US
Inventor(s)	01 / Tantoush, Mohammad A. 5409 Matthew Terrace Fremont, California 94555 / US
	[1999/01]
Representative(s)	Harris, Ian Richard, et al D Young & Co LLP 120 Holborn London EC1N 2DY / GB
	[N/P]
Former [1999/01]	Harris, Ian Richard, et al D. Young & Co., 21 New Fetter Lane London EC4A 1DA / GB
Application number, filing date	98305143.4	29.06.1998
	[1999/01]
Priority number, date	US19970885122	30.06.1997 Original published format: US 885122
	[1999/01]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0889524
	Date:	07.01.1999
	Language:	EN
	[1999/01]
	Type:	A3 Search report
	No.:	EP0889524
	Date:	03.03.1999
	[1999/09]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	19.01.1999
Classification	IPC:	H01L23/427, H01L23/367, H01L23/467	[1999/01]
	CPC:	H01L23/427 (EP,US); F28D15/0275 (EP,US); H01L23/367 (EP,US); H01L23/467 (EP,US); F28D15/0233 (EP,US); F28F3/02 (EP,US); (+) H01L2924/0002 (EP,US) (-)
	C-Set:	H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting states	DE, FR, GB, IT, NL, SE [1999/46]
Former [1999/01]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE
Title	German:	Skalierbares und modulares Wärmesenke-Wärmerohr Kühlsystem	[1999/01]
	English:	Scalable and modular heat sink-heat pipe cooling system	[1999/01]
	French:	Système de refroidissement échelonnable et modulaire de type dissipateur de chaleur-caloduc	[1999/01]
Examination procedure	09.08.1999	Examination requested [1999/40]
	02.08.2006	Despatch of a communication from the examining division (Time limit: M06)
	05.01.2007	Reply to a communication from the examining division
	29.03.2007	Communication of intention to grant the patent
	09.08.2007	Application deemed to be withdrawn, date of legal effect [2008/07]
	14.09.2007	Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2008/07]
Fees paid	Renewal fee
	05.06.2000	Renewal fee patent year 03
	06.06.2001	Renewal fee patent year 04
	24.06.2002	Renewal fee patent year 05
	26.06.2003	Renewal fee patent year 06
	14.06.2004	Renewal fee patent year 07
	14.06.2005	Renewal fee patent year 08
	14.06.2006	Renewal fee patent year 09
	Penalty fee
	Additional fee for renewal fee
	30.06.2007	10 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]EP0441572 (NGK INSULATORS LTD [JP]) [X] 1-3,5-7,9-11 * abstract *;
		[X]JPH03108747 ;
		[X]DE3825979 (LICENTIA GMBH [DE]) [X] 1,2,4-6,8-10,12 * column 1, line 68 - column 2, line 45; figures 1,2 *;
		[A]JPH07263601 ;
		[A]EP0661741 (HITACHI LTD [JP]) [A] 1-12 * column 17, line 51 - column 18, line 21; figure 28 *;
		[A]US5329993 (ETTEHADIEH EHSAN [US]) [A] 1-12 * column 1, line 15 - line 54 * * column 2, line 5 - line 28 * * figure 1 *;
		[A]JPH0362957 ;
		[A]US5379830 (ITOH AKIRA [JP]) [A] 4,8,12 * column 5, line 36 - line 41; figure 8 *
		[X] - PATENT ABSTRACTS OF JAPAN, (19910805), vol. 015, no. 304, Database accession no. (E - 1096), & JP03108747 A 19910508 (FURUKAWA ELECTRIC CO LTD:THE) [X] 1,2,4-6,8-10,12 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19960229), vol. 096, no. 002, & JP07263601 A 19951013 (FUJI ELECTRIC CO LTD) [A] 1-12 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19910605), vol. 015, no. 219, Database accession no. (E - 1074), & JP03062957 A 19910319 (FURUKAWA ELECTRIC CO LTD:THE) [A] 1,5,9 * abstract *

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.25; 35p