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EP About this file: EP0926706

EP0926706 - Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method [Right-click to bookmark this link]
Status	The application has been withdrawn Status updated on 14.04.2006 Database last updated on 03.09.2024
Most recent event Tooltip	14.04.2006	Withdrawal of application	published on 31.05.2006 [2006/22]
Applicant(s)	For all designated states CANON KABUSHIKI KAISHA 30-2, 3-chome, Shimomaruko, Ohta-ku Tokyo / JP
	[N/P]
Former [1999/26]	For all designated states CANON KABUSHIKI KAISHA 30-2, 3-chome, Shimomaruko, Ohta-ku Tokyo / JP
Inventor(s)	01 / Takisawa, Toru Canon Kabushiki Kaisha, 30-2, Shimomaruko 3-chome Ohta-ku, Tokyo / JP
	02 / Yonehara, Takao Canon Kabushiki Kaisha, 30-2, Shimomaruko 3-chome Ohta-ku, Tokyo / JP
	03 / Yamagata, Kenji Canon Kabushiki Kaisha, 30-2, Shimomaruko 3-chome Ohta-ku, Tokyo / JP
	[1999/26]
Representative(s)	Beresford, Keith Denis Lewis, et al Beresford Crump LLP 16 High Holborn London WC1V 6BX / GB
	[N/P]
Former [1999/26]	Beresford, Keith Denis Lewis, et al BERESFORD & Co. 2-5 Warwick Court High Holborn London WC1R 5DJ / GB
Application number, filing date	98310414.2	18.12.1998
	[1999/26]
Priority number, date	JP19970361011	26.12.1997 Original published format: JP 36101197
	JP19970361010	26.12.1997 Original published format: JP 36101097
	[1999/26]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0926706
	Date:	30.06.1999
	Language:	EN
	[1999/26]
	Type:	A3 Search report
	No.:	EP0926706
	Date:	06.02.2002
	[2002/06]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	19.12.2001
Classification	IPC:	H01L21/00	[1999/26]
	CPC:	H01L21/67092 (EP,US); H01L21/68 (KR); H01L21/6838 (EP,US)
Designated contracting states	AT, BE, DE, ES, FR, GB, IT, NL, SE [2002/43]
Former [1999/26]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE
Title	German:	Substratverarbeitungsvorrichtung, Substratträgervorrichtung, Substratverarbeitungsverfahren und Substratherstellungsverfahren	[1999/26]
	English:	Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method	[1999/26]
	French:	Appareil de traitement de substrats, support pour substrats, méthode de traitement de substrats et méthode de fabrication de substrats	[1999/26]
Examination procedure	28.06.2002	Examination requested [2002/35]
	01.12.2004	Despatch of a communication from the examining division (Time limit: M04)
	01.04.2005	Reply to a communication from the examining division
	21.03.2006	Despatch of a communication from the examining division (Time limit: M04)
	07.04.2006	Application withdrawn by applicant [2006/22]
Fees paid	Renewal fee
	21.12.2000	Renewal fee patent year 03
	19.12.2001	Renewal fee patent year 04
	19.12.2002	Renewal fee patent year 05
	22.12.2003	Renewal fee patent year 06
	20.12.2004	Renewal fee patent year 07
	02.01.2006	Renewal fee patent year 08
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XY]US5273553 (HOSHI TADAHIDE [JP], et al) [X] 1-28,58 * abstract * * column 1, line 45 - column 2, line 34 * * column 3, line 8 - column 6, line 66 * [Y] 47-55;
		[X]EP0256150 (TOSHIBA KK [JP]) [X] 1-28,58 * abstract * * column 2, line 29 - column 3, line 8 *;
		[A]US5534073 (KINOSHITA YOSHIMI [JP], et al) [A] 1-24 * abstract * * column 21, line 55 - column 24, line 55 *;
		[EL]EP0899778 (CANON KK [JP]) [EL] 1-28,58 * page -; figure -; claims 28,29 * * column 9, line 8 - column 16, line 22 * * (L: Priority) *;
		[XY]US4551192 (DI MILIA VINCENT [US], et al) [X] 29-46,56,57 * the whole document * [Y] 47-55;
		[X]GB2149697 (VARIAN ASSOCIATES) [X] 29-34,56,57 * the whole document *;
		[A]US5564682 (TSUJI HITOSHI [JP]) [A] 29-57 * abstract *

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