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Extract from the Register of European Patents

EP About this file: EP0992521

EP0992521 - Thermosetting resin composition [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  21.05.2004
Database last updated on 31.08.2024
Most recent event   Tooltip21.05.2004Withdrawal of applicationpublished on 07.07.2004  [2004/28]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo 101-8010 / JP
[N/P]
Former [2000/15]For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101-8010 / JP
Inventor(s)01 / Satsu, Yuichi
15-3-301, Omikacho 2-chome
Hitachi-shi / JP
02 / Nakai, Harukazu
20-3-508, Ayukawacho 6-chome
Hitachi-shi / JP
03 / Takahashi, Akio
3595, Kanaicho
Hitachiota-shi / JP
04 / Suzuki, Masao
17-2-302, Moriyamacho 3-chome
Hitachi-shi / JP
05 / Sugawara, Katsuo
15-2, Moriyamacho 1-chome
Hitachi-shi / JP
[2000/15]
Representative(s)Strehl Schübel-Hopf & Partner
Maximilianstrasse 54
80538 München / DE
[2000/15]
Application number, filing date99106062.525.03.1999
[2000/15]
Priority number, dateJP1998028379206.10.1998         Original published format: JP 28379298
[2000/15]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0992521
Date:12.04.2000
Language:EN
[2000/15]
Type: A3 Search report 
No.:EP0992521
Date:18.12.2002
[2002/51]
Search report(s)(Supplementary) European search report - dispatched on:EP06.11.2002
ClassificationIPC:C08G59/14, C08K5/5419, C08G59/40, C08L63/00, H01L23/29
[2002/34]
CPC:
C08G59/1433 (EP,US); C08L83/06 (KR); H01L2224/16225 (EP,US);
H01L2224/32225 (EP,US); H01L2224/45144 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US); H01L2224/48247 (EP,US); H01L2224/48465 (EP,US);
H01L2224/73204 (EP,US); H01L2224/83192 (EP,US); H01L2924/00014 (EP,US);
H01L2924/15311 (EP,US); H05K1/0366 (EP,US); H05K1/0373 (EP,US);
Y10T428/31663 (EP,US) (-)
C-Set:
H01L2224/45144, H01L2924/00 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP,US);
H01L2224/48465, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2924/00014, H01L2224/0401 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP)
(-)
Former IPC [2000/15]C08G59/14
Designated contracting statesDE,   FR,   GB [2003/37]
Former [2000/15]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Thermohärtende Harzzusammensetzung[2000/15]
English:Thermosetting resin composition[2000/15]
French:Composition de résine thermodurcissante[2000/15]
Examination procedure04.06.2003Examination requested  [2003/32]
11.05.2004Application withdrawn by applicant  [2004/28]
Fees paidRenewal fee
26.03.2001Renewal fee patent year 03
26.03.2002Renewal fee patent year 04
25.03.2003Renewal fee patent year 05
25.03.2004Renewal fee patent year 06
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Documents cited:Search[A]JPS5681333  ;
 [AX]US4250074  (FOSCANTE RAYMOND E [US], et al) [A] 1,3-5 * claim - * [X] 2;
 [X]US5618860  (MOWRER NORMAN R [US], et al) [X] 1-5 * column 14, line 16 - column 16, line 53; claim -; table - *;
 [AX]  - SERRIER, A ET AL, "Reactions in aminosilane- epoxy prepolymer systems", CHEMABS, CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US, XP002202528 [A] 1,3-5 * abstract * [X] 2
 [A]  - J. POLYM. SCI., PART A: POLYM. CHEM., (1991), vol. 29, no. 8, pages 1125 - 1131 [A] 1,3-5
 [A]  - PATENT ABSTRACTS OF JAPAN, (19810918), vol. 005, no. 148, Database accession no. (C - 072), & JP56081333 A 19810703 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1,3-5 * abstract *
 [A]  - YILGOR E ET AL, "1,3-bis(gamma-aminopropyl)tetramethyldisiloxane modified epoxy resins: curing and characterization", POLYMER, ELSEVIER SCIENCE PUBLISHERS B.V, GB, (19980401), vol. 39, no. 8-9, ISSN 0032-3861, pages 1691 - 1695, XP004101286 [A] 1 *The whole article" *

DOI:   http://dx.doi.org/10.1016/S0032-3861(97)00439-4
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