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Extract from the Register of European Patents

EP About this file: EP0948104

EP0948104 - Semiconductor laser module and method of manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.12.2003
Database last updated on 09.07.2024
Most recent event   Tooltip19.12.2003No opposition filed within time limitpublished on 04.02.2004  [2004/06]
Applicant(s)For all designated states
Sumitomo Electric Industries, Ltd.
5-33, Kitahama 4-chome, Chuo-ku Osaka-shi
Osaka / JP
[N/P]
Former [1999/40]For all designated states
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, Kitahama 4-chome, Chuo-ku
Osaka-shi, Osaka / JP
Inventor(s)01 / Takagi, Toshio c/o Yokohama Works of Sumitomo
Electric Industries, Ltd., 1, Taya-cho, Sakae-ku
Yokohama-shi, Kanagawa / JP
02 / Kato, Takashi c/o Yokohama Works of Sumitomo
Electric Industries, Ltd., 1, Taya-cho, Sakae-ku
Yokohama-shi, Kanagawa / JP
[1999/40]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [1999/40]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date99106545.930.03.1999
[1999/40]
Priority number, dateJP1998010216030.03.1998         Original published format: JP 10216098
[1999/40]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0948104
Date:06.10.1999
Language:EN
[1999/40]
Type: A3 Search report 
No.:EP0948104
Date:27.10.1999
[1999/43]
Type: B1 Patent specification 
No.:EP0948104
Date:12.02.2003
Language:EN
[2003/07]
Search report(s)(Supplementary) European search report - dispatched on:EP13.09.1999
ClassificationIPC:H01S5/022, G02B6/42
[2001/29]
CPC:
G02B6/4248 (EP,US); G02B6/4201 (EP,US); G02B6/424 (EP,US);
G02B6/4265 (EP,US); G02B6/4225 (EP,US); G02B6/4271 (EP,US);
G02B6/4286 (EP,US); H01S5/02216 (EP,US); H01S5/02251 (EP,US) (-)
Former IPC [1999/40]H01S3/025, G02B6/42
Designated contracting statesFR,   GB,   IT [2000/27]
Former [1999/40]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Halbleiterlaser-Modul und Herstellungsverfahren[1999/40]
English:Semiconductor laser module and method of manufacturing the same[1999/40]
French:Module à laser à semi-conducteur et procédé de fabrication[1999/40]
Examination procedure18.01.2000Examination requested  [2000/12]
05.06.2000Despatch of a communication from the examining division (Time limit: M04)
16.10.2000Reply to a communication from the examining division
13.08.2001Despatch of communication of intention to grant (Approval: No)
08.11.2001Despatch of communication of intention to grant (Approval: later approval)
30.11.2001Communication of intention to grant the patent
01.03.2002Fee for grant paid
01.03.2002Fee for publishing/printing paid
Opposition(s)13.11.2003No opposition filed within time limit [2004/06]
Fees paidRenewal fee
29.03.2001Renewal fee patent year 03
28.03.2002Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XA]WO8906816  (DU PONT [US]) [X] 1 * page 6, line 16 - page 11, line 14 * * page 12, line 1 - page 13, line 7; figures 3A-4 * [A] 9;
 [YA]EP0259018  (AMP INC [US]) [Y] 1 * column 2, line 1 - column 2, line 7 * * column 4, line 52 - column 8, line 42; figures 1-3,10 * [A] 9;
 [YA]EP0587895  (FUJITSU LTD [JP]) [Y] 1 * column 5, line 1 - column 7, line 41; figures 1A-3,19,20; claim 1 * [A] 9;
 [A]JPS6471193  ;
 [A]JPH04240607
 [A]  - PATENT ABSTRACTS OF JAPAN, (19890630), vol. 013, no. 288, Database accession no. (E - 781), & JP01071193 A 19890316 (JAPAN AVIATION ELECTRONICS IND LTD) [A] 1,9 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19930108), vol. 017, no. 010, Database accession no. (P - 1466), & JP04240607 A 19920827 (NEC CORP) [A] 1,9 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.