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Extract from the Register of European Patents

EP About this file: EP1043109

EP1043109 - Assembling method through welding of a coil with an integrated circuit or a small electronic unit [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.05.2005
Database last updated on 13.09.2024
Most recent event   Tooltip10.02.2006Lapse of the patent in a contracting state
New state(s): BE
published on 29.03.2006  [2006/13]
Applicant(s)For all designated states
EM Microelectronic-Marin SA
Rue des Sors 3
2074 Marin / CH
[2000/41]
Inventor(s)01 / Doering, Elko
Alte Bielstrasse 3
2572 Mörigen / CH
02 / Cattin, Pascal
Rue Laurent-Péroud 7
2088 Cressier / CH
03 / Thiemann, Uwe
Dorfstrasse 46
2076 Gals / CH
 [2004/29]
Former [2000/41]01 / Doering, Elko
Alte Bielstrasse 3
2572 Möringen / CH
02 / Cattin, Pascal
Rue Laurent-Péroud 7
2088 Cressier / CH
03 / Thiemann, Uwe
Dorfstrasse 46
2076 Gals / CH
Representative(s)Laurent, Jean, et al
I C B Ingénieurs Conseils en Brevets SA Rue des Sors 7
2074 Marin / CH
[N/P]
Former [2000/41]Laurent, Jean, et al
I C B Ingénieurs Conseils en Brevets SA Rue des Sors 7
CH-2074 Marin / CH
Application number, filing date99106603.631.03.1999
[2000/41]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP1043109
Date:11.10.2000
Language:FR
[2000/41]
Type: B1 Patent specification 
No.:EP1043109
Date:14.07.2004
Language:FR
[2004/29]
Search report(s)(Supplementary) European search report - dispatched on:EP14.09.1999
ClassificationIPC:B23K20/10
[2000/41]
CPC:
B23K20/10 (EP,US); H05K1/18 (KR); B23K2101/40 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   IT,   LI,   NL [2001/26]
Former [2000/41]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Verfahren zum Verbinden von einer Spule mit einer Mikroschaltung oder einer kleinen elektronischen Einheit durch Schweissen[2000/41]
English:Assembling method through welding of a coil with an integrated circuit or a small electronic unit[2000/41]
French:Procédé d'assemblage par soudage d'une bobine avec un circuit intégré ou une unité électronique de petites dimensions[2000/41]
Examination procedure11.04.2001Examination requested  [2001/24]
06.03.2003Despatch of a communication from the examining division (Time limit: M06)
30.08.2003Reply to a communication from the examining division
05.11.2003Communication of intention to grant the patent
17.05.2004Fee for grant paid
17.05.2004Fee for publishing/printing paid
Opposition(s)15.04.2005No opposition filed within time limit [2005/27]
Fees paidRenewal fee
02.04.2001Renewal fee patent year 03
02.04.2002Renewal fee patent year 04
31.03.2003Renewal fee patent year 05
31.03.2004Renewal fee patent year 06
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Lapses during opposition  TooltipES25.10.2004
BE31.03.2005
[2006/13]
Former [2005/23]ES25.10.2004
Documents cited:Search[Y]US5057661  (BANNER ALVIN C [US]) [Y] 7,8,10 * column 4, paragraph 3 ** column 6, paragraph 1; figures 5,6 *;
 [Y]US5186378  (ALFARO RAFAEL C [US]) [Y] 2 * abrégé;; figures 1,2 *;
 [XY]US5493069  (CONTI RICHARD F [US]) [X] 1,3-6,11,12 * column 3, paragraph L * * column 4, paragraph L - column 5, paragraph 1; figures 4,5 * [Y] 2,7,8,10
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.