EP0971366 - Conductive composite material and method for producing it [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.08.2005 Database last updated on 02.11.2024 | Most recent event Tooltip | 23.10.2009 | Change - representative | published on 25.11.2009 [2009/48] | Applicant(s) | For all designated states Pirelli Communications Cables and Systems USA, LLC 246 Stoneridge Drive, Suite 400 Columbia, SC 29210 / US | [2004/48] |
Former [2000/02] | For all designated states Pirelli Cables and Systems LLC 246 Stoneridge Drive Columbia, South Carolina 29210 / US | Inventor(s) | 01 /
Foulger, Stephen H. 216 Misty Oak Court Lexington, South Carolina 29072 / US | [2000/02] | Representative(s) | West, Alan Harry, et al R.G.C. Jenkins & Co 26 Caxton Street London SW1H 0RJ / GB | [2009/48] |
Former [2000/02] | West, Alan Harry, et al R.G.C. Jenkins & Co. 26 Caxton Street London SW1H 0RH / GB | Application number, filing date | 99305464.2 | 09.07.1999 | [2000/02] | Priority number, date | US19980113963 | 10.07.1998 Original published format: US 113963 | US19990307057 | 07.05.1999 Original published format: US 307057 | [2000/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0971366 | Date: | 12.01.2000 | Language: | EN | [2000/02] | Type: | B1 Patent specification | No.: | EP0971366 | Date: | 29.09.2004 | Language: | EN | [2004/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.09.1999 | Classification | IPC: | H01B1/20, H01B1/22, H01B1/24, C08K9/08 | [2000/02] | CPC: |
C08K3/08 (EP);
C08K3/04 (EP);
C08K7/06 (EP);
H01B1/20 (EP);
H01B1/22 (EP);
H01B1/24 (EP)
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE [2000/02] | Title | German: | Leitfähiges Verbundmaterial und Verfahren zu seiner Herstellung | [2000/02] | English: | Conductive composite material and method for producing it | [2000/02] | French: | Matériau composite conducteur et procédé pour sa fabrication | [2000/02] | Examination procedure | 06.07.2000 | Examination requested [2000/35] | 23.10.2002 | Despatch of a communication from the examining division (Time limit: M06) | 28.04.2003 | Reply to a communication from the examining division | 17.06.2003 | Despatch of a communication from the examining division (Time limit: M04) | 27.10.2003 | Reply to a communication from the examining division | 23.01.2004 | Communication of intention to grant the patent | 21.05.2004 | Fee for grant paid | 21.05.2004 | Fee for publishing/printing paid | Opposition(s) | 30.06.2005 | No opposition filed within time limit [2005/38] | Fees paid | Renewal fee | 12.07.2001 | Renewal fee patent year 03 | 12.07.2002 | Renewal fee patent year 04 | 14.07.2003 | Renewal fee patent year 05 | 28.07.2004 | Renewal fee patent year 06 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 29.09.2004 | BE | 29.09.2004 | CH | 29.09.2004 | FI | 29.09.2004 | LI | 29.09.2004 | NL | 29.09.2004 | DK | 29.12.2004 | GR | 29.12.2004 | SE | 29.12.2004 | PT | 28.02.2005 | [2008/17] |
Former [2006/14] | AT | 29.09.2004 | |
BE | 29.09.2004 | ||
CH | 29.09.2004 | ||
FI | 29.09.2004 | ||
LI | 29.09.2004 | ||
NL | 29.09.2004 | ||
DK | 29.12.2004 | ||
GR | 29.12.2004 | ||
SE | 29.12.2004 | ||
Former [2005/46] | AT | 29.09.2004 | |
BE | 29.09.2004 | ||
CH | 29.09.2004 | ||
FI | 29.09.2004 | ||
LI | 29.09.2004 | ||
DK | 29.12.2004 | ||
GR | 29.12.2004 | ||
SE | 29.12.2004 | ||
Former [2005/28] | AT | 29.09.2004 | |
BE | 29.09.2004 | ||
CH | 29.09.2004 | ||
FI | 29.09.2004 | ||
LI | 29.09.2004 | ||
GR | 29.12.2004 | ||
SE | 29.12.2004 | ||
Former [2005/25] | AT | 29.09.2004 | |
CH | 29.09.2004 | ||
FI | 29.09.2004 | ||
LI | 29.09.2004 | ||
GR | 29.12.2004 | ||
SE | 29.12.2004 | ||
Former [2005/18] | AT | 29.09.2004 | |
FI | 29.09.2004 | ||
GR | 29.12.2004 | ||
SE | 29.12.2004 | ||
Former [2005/13] | AT | 29.09.2004 | |
FI | 29.09.2004 | ||
SE | 29.12.2004 | ||
Former [2005/11] | FI | 29.09.2004 | |
SE | 29.12.2004 | ||
Former [2005/10] | SE | 29.12.2004 | Documents cited: | Search | [DX] - TCHOUDAKOV R ET AL, "Conductive polymer blends with low carbon black loading: polypropylene/polyamide", POLYM ENG SCI;POLYMER ENGINEERING AND SCIENCE MAY 1996 SOC OF PLASTICS ENGINEERS, BROOKFIELD, CT, USA, (199605), vol. 36, no. 10, pages 1336 - 1346, XP000637000 [DX] 1-4,11,15 * page 1338, column 1; figure 3 * | [DX] - GUBBELS F ET AL, "Design of electrical conductive composites: key role of the morphology on the electrical properties of carbon black filled polymer blends", MACROMOLECULES;MACROMOLECULES FEB 27 1995 ACS, WASHINGTON, DC, USA, (19950227), vol. 28, no. 5, pages 1559 - 1566, XP002083985 [DX] 1-4,6 * Results and Discussion: 1.Morphological Analysis and 3.Electrical Properties. Conclusions * DOI: http://dx.doi.org/10.1021/ma00109a030 | [X] - GUBBELS F ET AL, "Selective localization of carbon black in immiscible polymer blends: a useful tool to design electrical conductive composites", MACROMOLECULES;MACROMOLECULES MAR 28 1994, (19940328), vol. 27, no. 7, pages 1972 - 1974, XP002083986 [X] 1,3,4 * page 1972; figure 1 * DOI: http://dx.doi.org/10.1021/ma00085a049 | [X] - KOZLOWSKI M, "Electrically conductive structured polymer blends", POLYM NETWORKS BLENDS;POLYMER NETWORKS & BLENDS 1995 CHEMTEC PUBL, TORONTO, ONT, CAN, (1995), vol. 5, no. 4, pages 163 - 172, XP002083987 [X] 1-4,16 * abstract * | [A] - TANG H ET AL, "Electrical behavior of carbon black-filled polymer composites: effect of interaction between filler and matrix", J APPL POLYM SCI;JOURNAL OF APPLIED POLYMER SCIENCE FEB 14 1994 PUBL BY JOHN WILEY & SONS INC, NEW YORK, NY, USA, (19940214), vol. 51, no. 7, pages 1159 - 1164, XP000465171 [A] 1-4,6,7 * abstract * DOI: http://dx.doi.org/10.1002/app.1994.070510701 |