-
EP0999250
European procedure
Extract from the Register of European Patents
EP About this file: EP0999250
| EP0999250 - Pressure sensitive adhesive sheet for use in semiconductor wafer working [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 04.02.2005 Database last updated on 03.04.2025 | Most recent event Tooltip | 04.02.2005 | No opposition filed within time limit | published on 23.03.2005 [2005/12] | Applicant(s) | For all designated states Lintec Corporation 23-23, Honcho, Itabashi-ku Tokyo 173-0001 / JP | [N/P] |
| Former [2000/19] | For all designated states Lintec Corporation 23-23, Honcho, Itabashi-ku Tokyo 173-0001 / JP | Inventor(s) | 01 /
Kondo, Takeshi 401 Lintec Dai-2 Urawaryo, 7-7-3 Tsuji Urawa-shi, Saitama 336-0026 / JP | 02 /
Takahashi, Kazuhiro 5-3-17 Shiba Kawaguchi-shi, Saitama 333-0866 / JP | 03 /
Mineura, Yoshihisa 201 Sun House, 15-7 Naka-cho Itabashi-ku, Tokyo 173-0022 / JP | [2000/19] | Representative(s) | Towler, Philip Dean, et al Dehns St Bride's House 10 Salisbury Square London EC4Y 8JD / GB | [N/P] |
| Former [2001/15] | Towler, Philip Dean, et al Frank B. Dehn & Co., European Patent Attorneys, 179 Queen Victoria Street London EC4V 4EL / GB | ||
| Former [2000/19] | Skailes, Humphrey John Frank B. Dehn & Co., European Patent Attorneys, 179 Queen Victoria Street London EC4V 4EL / GB | Application number, filing date | 99308819.4 | 05.11.1999 | [2000/19] | Priority number, date | JP19980316059 | 06.11.1998 Original published format: JP 31605998 | [2000/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0999250 | Date: | 10.05.2000 | Language: | EN | [2000/19] | Type: | A3 Search report | No.: | EP0999250 | Date: | 04.10.2000 | [2000/40] | Type: | B1 Patent specification | No.: | EP0999250 | Date: | 31.03.2004 | Language: | EN | [2004/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.08.2000 | Classification | IPC: | C09J7/02, H01L21/68, B24B37/04 | [2000/19] | CPC: |
H01L21/6835 (EP);
H01L21/68 (KR);
C09J7/22 (EP);
C09J7/38 (EP);
H01L21/6836 (EP);
C09J2203/326 (EP);
C09J2301/302 (EP);
C09J2433/00 (EP);
C09J2433/006 (EP);
| Designated contracting states | DE, FR, GB, IT [2001/25] |
| Former [2000/19] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Druckempfindlicher Klebefilm zur Verwendung in der Halbleiterwaferbearbeitung | [2000/19] | English: | Pressure sensitive adhesive sheet for use in semiconductor wafer working | [2000/19] | French: | Film adhésif autocollant utilisé pour le traitement de plaquettes semi-conductrices | [2000/19] | Examination procedure | 07.03.2001 | Examination requested [2001/18] | 05.04.2001 | Loss of particular rights, legal effect: designated state(s) | 16.08.2001 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, CY, DK, ES, FI, GR, IE, LI, LU, MC, NL, PT, SE | 22.10.2002 | Despatch of a communication from the examining division (Time limit: M04) | 28.02.2003 | Reply to a communication from the examining division | 19.03.2003 | Despatch of a communication from the examining division (Time limit: M04) | 25.07.2003 | Reply to a communication from the examining division | 08.10.2003 | Communication of intention to grant the patent | 22.01.2004 | Fee for grant paid | 22.01.2004 | Fee for publishing/printing paid | Opposition(s) | 04.01.2005 | No opposition filed within time limit [2005/12] | Fees paid | Renewal fee | 26.11.2001 | Renewal fee patent year 03 | 29.10.2002 | Renewal fee patent year 04 | 25.11.2003 | Renewal fee patent year 05 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 28.05.2001 | AT M01 Not yet paid | 28.05.2001 | BE M01 Not yet paid | 28.05.2001 | CH M01 Not yet paid | 28.05.2001 | CY M01 Not yet paid | 28.05.2001 | DK M01 Not yet paid | 28.05.2001 | ES M01 Not yet paid | 28.05.2001 | FI M01 Not yet paid | 28.05.2001 | GR M01 Not yet paid | 28.05.2001 | IE M01 Not yet paid | 28.05.2001 | LU M01 Not yet paid | 28.05.2001 | MC M01 Not yet paid | 28.05.2001 | NL M01 Not yet paid | 28.05.2001 | PT M01 Not yet paid | 28.05.2001 | SE M01 Not yet paid |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JPH0745557 ; | [X]JPS62127376 ; | [X]EP0768354 (NITTO DENKO CORP [JP], et al) [X] 1,2* page 2, line 46 - line 50 *; | [X]EP0798355 (LINTEC CORP [JP]) [X] 1-3,5 * claims 1,2 * * examples 1-3 *; | [X] - PATENT ABSTRACTS OF JAPAN, (19950630), vol. 1995, no. 05, & JP07045557 A 19950214 (LINTEC CORP) [X] 1,4,5 * abstract * | [X] - DATABASE WPI, 1, Derwent World Patents Index, vol. 1987, no. 28, Database accession no. 1987-196498, XP002144375 & JPS62127376 A 19870609 (NITTO ELECTRIC IND CO) [X] 1,4 * abstract * |