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Extract from the Register of European Patents

EP About this file: EP1054444

EP1054444 - Process for depositing a porous, low dielectric constant silicon oxide film [Right-click to bookmark this link]
StatusThe application has been refused
Status updated on  15.10.2010
Database last updated on 31.08.2024
Most recent event   Tooltip15.10.2010Refusal of applicationpublished on 17.11.2010  [2010/46]
Applicant(s)For all designated states
Applied Materials, Inc.
P.O. Box 450A
Santa Clara, California 95052 / US
[N/P]
Former [2000/47]For all designated states
Applied Materials, Inc.
P.O. Box 450A
Santa Clara, California 95052 / US
Inventor(s)01 / Geiger, Fabrice
29 avenue de la Pleine Fleurie
38240 Meylan / FR
02 / Gaillard, Frederic
rue des Tallifardieres
38500 Voiron / FR
[2000/47]
Representative(s)Kirschner, Klaus Dieter, et al
Puschmann Borchert Bardehle
Patentanwälte Partnerschaft
Postfach 10 12 31
80086 München / DE
[N/P]
Former [2008/28]Kirschner, Klaus Dieter, et al
Puschmann & Borchert Patentanwälte Bajuwarenring 21
82041 Oberhaching / DE
Former [2006/40]Kirschner, Klaus Dieter, et al
Kirschner Patentanwaltskanzlei Südliche Münchnerstrasse 53
82031 Grünwald / DE
Former [2000/47]Kirschner, Klaus Dieter, Dipl.-Phys., et al
Schneiders & Behrendt Rechtsanwälte - Patentanwälte Sollner Strasse 38
81479 München / DE
Application number, filing date99401202.919.05.1999
[2000/47]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1054444
Date:22.11.2000
Language:EN
[2000/47]
Search report(s)(Supplementary) European search report - dispatched on:EP27.10.1999
ClassificationIPC:H01L21/316
[2000/47]
CPC:
H01L21/02126 (EP); C23C16/402 (EP); H01L21/02203 (EP);
H01L21/02271 (EP); H01L21/02304 (EP); H01L21/02362 (EP)
Designated contracting statesDE,   GB [2001/32]
Former [2000/47]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Abscheidungsverfahren für einen porösen SiO2-Film mit einer niedrigen Dielektrizitätskonstante[2000/47]
English:Process for depositing a porous, low dielectric constant silicon oxide film[2000/47]
French:Procédé de dépôt d'une couche poreuse de oxyde de silicium ayant une constante dielectrique faible[2000/47]
Examination procedure21.05.2001Examination requested  [2001/31]
23.05.2001Loss of particular rights, legal effect: designated state(s)
11.09.2001Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, CY, DK, ES, FI, FR, GR, IE, IT, LI, LU, MC, NL, PT, SE
13.09.2006Despatch of a communication from the examining division (Time limit: M06)
02.05.2007Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
11.06.2007Reply to a communication from the examining division
22.02.2008Despatch of a communication from the examining division (Time limit: M04)
12.06.2008Reply to a communication from the examining division
03.06.2010Date of oral proceedings
25.06.2010Despatch of communication that the application is refused, reason: substantive examination [2010/46]
25.06.2010Minutes of oral proceedings despatched
05.07.2010Application refused, date of legal effect [2010/46]
Request for further processing for:11.06.2000Request for further processing filed
11.06.2007Full payment received (date of receipt of payment)
Request granted
22.06.2007Decision despatched
Fees paidRenewal fee
30.05.2001Renewal fee patent year 03
31.05.2002Renewal fee patent year 04
02.06.2003Renewal fee patent year 05
05.05.2004Renewal fee patent year 06
13.05.2005Renewal fee patent year 07
27.03.2006Renewal fee patent year 08
07.05.2007Renewal fee patent year 09
18.03.2008Renewal fee patent year 10
07.05.2009Renewal fee patent year 11
Penalty fee
Penalty fee Rule 85a EPC 1973
26.06.2001AT   M01   Not yet paid
26.06.2001BE   M01   Not yet paid
26.06.2001CH   M01   Not yet paid
26.06.2001CY   M01   Not yet paid
26.06.2001DK   M01   Not yet paid
26.06.2001ES   M01   Not yet paid
26.06.2001FI   M01   Not yet paid
26.06.2001FR   M01   Not yet paid
26.06.2001GR   M01   Not yet paid
26.06.2001IE   M01   Not yet paid
26.06.2001IT   M01   Not yet paid
26.06.2001LU   M01   Not yet paid
26.06.2001MC   M01   Not yet paid
26.06.2001NL   M01   Not yet paid
26.06.2001PT   M01   Not yet paid
26.06.2001SE   M01   Not yet paid
Additional fee for renewal fee
31.05.201012   M06   Not yet paid
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Documents cited:Search[X]US5804509  (CHO GYUNG-SU [KR]) [X] 1,5,6 * column 2, line 50 - column 4, line 21 *;
 [X]JPH1197533  ;
 [X]EP0822585  (APPLIED MATERIALS INC [US]) [X] 20 * the whole document *;
 [A]US5472913  (HAVEMANN ROBERT H [US], et al) [A] 1,4,7 * column 4, line 15 - column 6, line 25 *;
 [A]US5271972  (KWOK KURT [US], et al) [A] * the whole document *;
 [A]US5426076  (MOGHADAM FARHAD K [US]) [A] * column 2, line 19 - line 41 *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19990730), vol. 1999, no. 09, & JP11097533 A 19990409 (HITACHI LTD) [X] 1 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.