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EP1077274
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EP About this file: EP1077274
| EP1077274 - Method for depositing thin films in particular of a low-k dielectric [Right-click to bookmark this link] | |||
| Former [2001/08] | Lid cooling mechanism and method for optimized deposition of low-k dielectric using tri methylsilane-ozone based processes | ||
| [2009/43] | Status | The application is deemed to be withdrawn Status updated on 23.07.2010 Database last updated on 31.08.2024 | Most recent event Tooltip | 23.07.2010 | Application deemed to be withdrawn | published on 25.08.2010 [2010/34] | Applicant(s) | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US | [N/P] |
| Former [2001/08] | For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, California 95054 / US | Inventor(s) | 01 /
Pokhama, Himansu 439 Camille Circle, 13 San Jose, CA 95134 / US | 02 /
Xia, Li-Qun 5358 Carryback Avenue San Jose, CA 95111 / US | 03 /
Lim, Tian-Hoe 3238 Saint Ignatius Place, 338 Santa Clara, CA 95051 / US | [2007/32] |
| Former [2001/08] | 01 /
Pokhama, Himansu 439 Camille Circle, 13 San Jose, CA 95134 / US | ||
| 02 /
Xia, Li-Qun 5358 Carryback Avenue San Jose, CA 95111 / US | |||
| 03 /
Lim, Tian-Hoe 3238 Saint Ignatius Place, #338 Santa Clara, CA 95051 / US | Representative(s) | Bayliss, Geoffrey Cyril, et al BOULT WADE TENNANT Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | [N/P] |
| Former [2009/52] | Bayliss, Geoffrey Cyril, et al Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | ||
| Former [2001/08] | Bayliss, Geoffrey Cyril, et al BOULT, WADE & TENNANT 27 Furnival Street London EC4A 1PQ / GB | Application number, filing date | 99402073.3 | 17.08.1999 | [2001/08] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1077274 | Date: | 21.02.2001 | Language: | EN | [2001/08] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.01.2000 | Classification | IPC: | C23C16/44, H01L21/316, C23C16/40 | [2001/08] | CPC: |
C23C16/45572 (EP,US);
C23C16/401 (EP,US);
C23C16/4411 (EP,US);
C23C16/455 (EP,US);
H01L21/02126 (EP,US);
H01L21/022 (EP,US);
H01L21/02203 (EP,US);
H01L21/02208 (EP,US);
H01L21/02211 (EP,US);
H01L21/02271 (EP,US);
H01L21/02274 (EP,US);
H01L21/02312 (EP,US);
H01L21/02337 (EP,US);
H01L21/0234 (EP,US);
H01L21/02362 (EP,US);
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE [2001/08] | Title | German: | Verfahren zur Abscheidung von dünnen Schichten insbesondere eines Dielektrikums mit niedrigem k-Wert | [2009/43] | English: | Method for depositing thin films in particular of a low-k dielectric | [2009/43] | French: | Méthode de déposition des couches minces notamment d'un matériau diélectrique à faible constante diélectrique | [2009/43] |
| Former [2001/08] | Vorrichtung zur Kühlung eines Deckels sowie Verfahren zum Auftragen eines Dielektrikums mit niedrigem k-Wert | ||
| Former [2001/08] | Lid cooling mechanism and method for optimized deposition of low-k dielectric using tri methylsilane-ozone based processes | ||
| Former [2001/08] | Dispositif de refroidissement d'un couvercle et méthode de déposition d'un matériau diélectrique à faible constante diélectrique | Examination procedure | 09.08.2001 | Examination requested [2001/41] | 22.03.2007 | Despatch of a communication from the examining division (Time limit: M06) | 01.10.2007 | Reply to a communication from the examining division | 28.01.2008 | Despatch of a communication from the examining division (Time limit: M04) | 27.05.2008 | Reply to a communication from the examining division | 26.10.2009 | Communication of intention to grant the patent | 02.03.2010 | Application deemed to be withdrawn, date of legal effect [2010/34] | 06.04.2010 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2010/34] | Fees paid | Renewal fee | 03.08.2001 | Renewal fee patent year 03 | 12.08.2002 | Renewal fee patent year 04 | 06.08.2003 | Renewal fee patent year 05 | 06.08.2004 | Renewal fee patent year 06 | 08.08.2005 | Renewal fee patent year 07 | 07.08.2006 | Renewal fee patent year 08 | 03.08.2007 | Renewal fee patent year 09 | 08.08.2008 | Renewal fee patent year 10 | Penalty fee | Additional fee for renewal fee | 31.08.2009 | 11 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]EP0738788 (EBARA CORP [JP]) [X] 1-6,9-12 * column 9, line 9 - column 11, line 41; figure 1; claim - * [A] 13-20; | [A]EP0774533 (DOW CORNING [US]) [A] 13-20 * claims 1,2,4 *; | [A]US5871586 (CRAWLEY JOHN A [GB], et al) [A] 1-20 * column 4, line 59 - column 5, line 18 * * column 5, line 46 - column 6, line 8; figure 11 *; | [A]US5872065 (SIVARAMAKRISHNAN VISWESWAREN [US]) [A] 21* column 5, line 3 - column 6, line 13 * |