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Extract from the Register of European Patents

EP About this file: EP1072180

EP1072180 - INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  28.06.2002
Database last updated on 20.09.2024
Most recent event   Tooltip28.06.2002Application deemed to be withdrawnpublished on 14.08.2002  [2002/33]
Applicant(s)For all designated states
ADVANCED INTERCONNECTIONS CORPORATION
5 Energy Way West Warwick
Rhode Island 02893 / US
[N/P]
Former [2001/05]For all designated states
ADVANCED INTERCONNECTIONS CORPORATION
5 Energy Way
West Warwick Rhode Island 02893 / US
Inventor(s)01 / MURPHY, James, V.
28 Ladderhook Road
Warwick, RI 02886 / US
 [2001/05]
Representative(s)Charig, Raymond Julian
Potter Clarkson LLP The Belgrave Centre
Talbot Street
Nottingham NG1 5GG / GB
[N/P]
Former [2001/05]Charig, Raymond Julian
Eric Potter Clarkson, Park View House, 58 The Ropewalk
Nottingham NG1 5DD / GB
Application number, filing date99919895.516.04.1999
[2001/05]
WO1999US08545
Priority number, dateUS1998006221517.04.1998         Original published format: US 62215
[2001/05]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9956515
Date:04.11.1999
Language:EN
[1999/44]
Type: A1 Application with search report 
No.:EP1072180
Date:31.01.2001
Language:EN
The application published by WIPO in one of the EPO official languages on 04.11.1999 takes the place of the publication of the European patent application.
[2001/05]
Search report(s)International search report - published on:US04.11.1999
(Supplementary) European search report - dispatched on:EP14.03.2002
ClassificationIPC:H05K7/20, H01L23/32
[2002/18]
CPC:
H01L23/32 (EP,US); H01L23/4006 (EP,US); H01L2023/405 (EP,US);
H01L2023/4062 (EP,US); H01L2023/4068 (EP,US); H01L2023/4087 (EP,US);
H01L2924/0002 (EP,US); H01L2924/1433 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Former IPC [2001/05]H05K7/20
Designated contracting statesCH,   DE,   FR,   GB,   IE,   LI [2001/05]
TitleGerman:IC-FASSUNG MIT KÜHLKÖRPER[2001/05]
English:INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK[2001/05]
French:COMPOSANT D'INTERCOUPLAGE DE CIRCUITS INTEGRES A PUITS THERMIQUE[2001/05]
Entry into regional phase30.10.2000National basic fee paid 
30.10.2000Search fee paid 
30.10.2000Designation fee(s) paid 
30.10.2000Examination fee paid 
Examination procedure08.11.1999Request for preliminary examination filed
International Preliminary Examining Authority: US
30.10.2000Examination requested  [2001/06]
01.11.2001Application deemed to be withdrawn, date of legal effect  [2002/33]
24.01.2002Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2002/33]
Fees paidPenalty fee
Additional fee for renewal fee
30.04.200103   M06   Not yet paid
30.04.200204   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XAY]EP0449150  (LABINAL COMPONENTS & SYSTEMS [US]) [X] 1 * column 5, line 56 - column 13, line 34; figure 6 * [A] 8-17,22-24 [Y] 2-7,18-21;
 [Y]JPH04139753  ;
 [A]JPH05326091  ;
 [A]US5313099  (TATA PETER D [US], et al) [A] 1-24 * figure 1 *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19920902), vol. 016, no. 415, Database accession no. (E - 1257), & JP04139753 A 19920513 (TOSHIBA CORP) [Y] 2-7,18-21 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19940308), vol. 018, no. 139, Database accession no. (E - 1519), & JP05326091 A 19931210 (MATSUSHITA ELECTRIC IND CO LTD) [A] 1 * abstract *
International search[A]US5019940  (CLEMENS DONALD L [US]);
 [A]US5671121  (MCMAHON JOHN FRANCIS [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.