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Extract from the Register of European Patents

EP About this file: EP1218289

EP1218289 - DISSOLVED WAFER FABRICATION PROCESS AND ASSOCIATED MICROELECTROMECHANICAL DEVICE HAVING A SUPPORT SUBSTRATE WITH SPACING MESAS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  13.01.2012
Database last updated on 03.09.2024
Most recent event   Tooltip17.05.2013Lapse of the patent in a contracting state
New state(s): LU		published on 19.06.2013  [2013/25]
Applicant(s)For all designated states
HONEYWELL INC.
Honeywell Plaza
Minneapolis, MN 55408 / US
[2011/10]
Former [2002/27]For all designated states
HONEYWELL INC.
Honeywell Plaza
Minneapolis Minnesota 55408 / US
Inventor(s)01 / MAXWELL, Ken, Hays
13401 Sussex Place
Santa Ana, CA 92705-2120 / US
 [2002/27]
Representative(s)Buckley, Guy Julian
Patent Outsourcing Limited
1 King Street
Bakewell
Derbyshire DE45 1DZ / GB
[N/P]
Former [2010/48]Buckley, Guy Julian
Patent Outsourcing Limited Cornerhourse 1 King Street Bakewell
Derbyshire DE45 1EW / GB
Former [2009/15]Smee, Anthony James Michael, et al
Gill Jennings & Every LLP Broadgate House 7 Eldon Street
London EC2M 7LH / GB
Former [2002/27]Hucker, Charlotte Jane
Gill Jennings & Every Broadgate House, 7 Eldon Street
London EC2M 7LH / GB
Application number, filing date99969587.728.09.1999
[2002/27]
WO1999US22467
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO0123300
Date:05.04.2001
Language:EN
[2001/14]
Type: A1 Application with search report 
No.:EP1218289
Date:03.07.2002
Language:EN
The application published by WIPO in one of the EPO official languages on 05.04.2001 takes the place of the publication of the European patent application.
[2002/27]
Type: B1 Patent specification 
No.:EP1218289
Date:09.03.2011
Language:EN
[2011/10]
Search report(s)International search report - published on:EP05.04.2001
ClassificationIPC:B81C1/00, H01L21/18
[2002/27]
CPC:
B81C1/00357 (EP); B81C2201/019 (EP)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE [2002/27]
TitleGerman:HERSTELLUNGSVERFAHREN MIT AUFLÖSUNG DER HALBLEITERSCHEIBE UND ENTSPRECHENDE MIKROELEKTROMECHANISCHE VORRICHTUNG AUF EINEM TRÄGERSUBSTRAT MIT DISTANZMESAS[2002/27]
English:DISSOLVED WAFER FABRICATION PROCESS AND ASSOCIATED MICROELECTROMECHANICAL DEVICE HAVING A SUPPORT SUBSTRATE WITH SPACING MESAS[2002/27]
French:PROCEDE DE FABRICATION DE PLAQUETTE DISSOUT ET DISPOSITIF MICRO-ELECTROMECANIQUE ASSOCIE A SUBSTRAT DE SUPPORT COMPOSE DE MESAS D'ECARTEMENT[2002/27]
Entry into regional phase26.03.2002National basic fee paid 
26.03.2002Designation fee(s) paid 
26.03.2002Examination fee paid 
Examination procedure23.04.2001Request for preliminary examination filed
International Preliminary Examining Authority: EP
26.03.2002Examination requested  [2002/27]
29.01.2009Despatch of a communication from the examining division (Time limit: M04)
27.05.2009Reply to a communication from the examining division
20.05.2010Despatch of a communication from the examining division (Time limit: M04)
30.09.2010Reply to a communication from the examining division
22.11.2010Communication of intention to grant the patent
26.01.2011Fee for grant paid
26.01.2011Fee for publishing/printing paid
Opposition(s)12.12.2011No opposition filed within time limit [2012/07]
Fees paidRenewal fee
19.04.2002Renewal fee patent year 03
05.09.2002Renewal fee patent year 04
04.09.2003Renewal fee patent year 05
06.09.2004Renewal fee patent year 06
05.09.2005Renewal fee patent year 07
08.09.2006Renewal fee patent year 08
05.09.2007Renewal fee patent year 09
27.03.2008Renewal fee patent year 10
04.09.2009Renewal fee patent year 11
07.09.2010Renewal fee patent year 12
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
IT09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
IE28.09.2011
LU28.09.2011
CH30.09.2011
LI30.09.2011
MC30.09.2011
[2013/25]
Former [2012/35]AT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
IT09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
IE28.09.2011
CH30.09.2011
LI30.09.2011
MC30.09.2011
Former [2012/33]AT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
IT09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
CH30.09.2011
LI30.09.2011
MC30.09.2011
Former [2012/23]AT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
IT09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
MC30.09.2011
Former [2012/20]AT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
MC30.09.2011
Former [2012/10]AT09.03.2011
BE09.03.2011
CY09.03.2011
DK09.03.2011
FI09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
Former [2011/47]AT09.03.2011
BE09.03.2011
CY09.03.2011
FI09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
PT11.07.2011
Former [2011/41]AT09.03.2011
BE09.03.2011
CY09.03.2011
FI09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
Former [2011/39]AT09.03.2011
CY09.03.2011
FI09.03.2011
NL09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
Former [2011/37]CY09.03.2011
FI09.03.2011
SE09.03.2011
GR10.06.2011
ES20.06.2011
Former [2011/36]SE09.03.2011
GR10.06.2011
ES20.06.2011
Cited inInternational search[X]US5273939  (BECKER ROLF [DE], et al) [X] 16,19,20 * column 4, line 64 - column 5, line 12; figures 3A-3D *;
 [XA]US5578843  (GARABEDIAN RAFFI M [US], et al) [X] 1,2,8,16 * column 5 - column 8; figures 1I,3B,10A * * column 13 * [A] 10;
 [A]US5650568  (GREIFF PAUL [US], et al) [A] * cited by the applicant; column 3, line 50 - line 65; figure 17 ** column 18, line 32 - line 65 *;
 [XA]EP0820104  (HUGHES AIRCRAFT CO [US]) [X] 1,7,8 * column 8, line 33 - line 54; figure 5 * [A] 10
Examination   - SCHRODER, SEMICONDUCTOR MATERIAL AND DEVICE CHARACTERIZATION, USA, WILEY, pages 203 - 207
by applicantUS5650568
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.