EP1218289 - DISSOLVED WAFER FABRICATION PROCESS AND ASSOCIATED MICROELECTROMECHANICAL DEVICE HAVING A SUPPORT SUBSTRATE WITH SPACING MESAS [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.01.2012 Database last updated on 03.09.2024 | Most recent event Tooltip | 17.05.2013 | Lapse of the patent in a contracting state New state(s): LU | published on 19.06.2013 [2013/25] | Applicant(s) | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis, MN 55408 / US | [2011/10] |
Former [2002/27] | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis Minnesota 55408 / US | Inventor(s) | 01 /
MAXWELL, Ken, Hays 13401 Sussex Place Santa Ana, CA 92705-2120 / US | [2002/27] | Representative(s) | Buckley, Guy Julian Patent Outsourcing Limited 1 King Street Bakewell Derbyshire DE45 1DZ / GB | [N/P] |
Former [2010/48] | Buckley, Guy Julian Patent Outsourcing Limited Cornerhourse 1 King Street Bakewell Derbyshire DE45 1EW / GB | ||
Former [2009/15] | Smee, Anthony James Michael, et al Gill Jennings & Every LLP Broadgate House 7 Eldon Street London EC2M 7LH / GB | ||
Former [2002/27] | Hucker, Charlotte Jane Gill Jennings & Every Broadgate House, 7 Eldon Street London EC2M 7LH / GB | Application number, filing date | 99969587.7 | 28.09.1999 | [2002/27] | WO1999US22467 | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO0123300 | Date: | 05.04.2001 | Language: | EN | [2001/14] | Type: | A1 Application with search report | No.: | EP1218289 | Date: | 03.07.2002 | Language: | EN | The application published by WIPO in one of the EPO official languages on 05.04.2001 takes the place of the publication of the European patent application. | [2002/27] | Type: | B1 Patent specification | No.: | EP1218289 | Date: | 09.03.2011 | Language: | EN | [2011/10] | Search report(s) | International search report - published on: | EP | 05.04.2001 | Classification | IPC: | B81C1/00, H01L21/18 | [2002/27] | CPC: |
B81C1/00357 (EP);
B81C2201/019 (EP)
| Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE [2002/27] | Title | German: | HERSTELLUNGSVERFAHREN MIT AUFLÖSUNG DER HALBLEITERSCHEIBE UND ENTSPRECHENDE MIKROELEKTROMECHANISCHE VORRICHTUNG AUF EINEM TRÄGERSUBSTRAT MIT DISTANZMESAS | [2002/27] | English: | DISSOLVED WAFER FABRICATION PROCESS AND ASSOCIATED MICROELECTROMECHANICAL DEVICE HAVING A SUPPORT SUBSTRATE WITH SPACING MESAS | [2002/27] | French: | PROCEDE DE FABRICATION DE PLAQUETTE DISSOUT ET DISPOSITIF MICRO-ELECTROMECANIQUE ASSOCIE A SUBSTRAT DE SUPPORT COMPOSE DE MESAS D'ECARTEMENT | [2002/27] | Entry into regional phase | 26.03.2002 | National basic fee paid | 26.03.2002 | Designation fee(s) paid | 26.03.2002 | Examination fee paid | Examination procedure | 23.04.2001 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 26.03.2002 | Examination requested [2002/27] | 29.01.2009 | Despatch of a communication from the examining division (Time limit: M04) | 27.05.2009 | Reply to a communication from the examining division | 20.05.2010 | Despatch of a communication from the examining division (Time limit: M04) | 30.09.2010 | Reply to a communication from the examining division | 22.11.2010 | Communication of intention to grant the patent | 26.01.2011 | Fee for grant paid | 26.01.2011 | Fee for publishing/printing paid | Opposition(s) | 12.12.2011 | No opposition filed within time limit [2012/07] | Fees paid | Renewal fee | 19.04.2002 | Renewal fee patent year 03 | 05.09.2002 | Renewal fee patent year 04 | 04.09.2003 | Renewal fee patent year 05 | 06.09.2004 | Renewal fee patent year 06 | 05.09.2005 | Renewal fee patent year 07 | 08.09.2006 | Renewal fee patent year 08 | 05.09.2007 | Renewal fee patent year 09 | 27.03.2008 | Renewal fee patent year 10 | 04.09.2009 | Renewal fee patent year 11 | 07.09.2010 | Renewal fee patent year 12 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 09.03.2011 | BE | 09.03.2011 | CY | 09.03.2011 | DK | 09.03.2011 | FI | 09.03.2011 | IT | 09.03.2011 | NL | 09.03.2011 | SE | 09.03.2011 | GR | 10.06.2011 | ES | 20.06.2011 | PT | 11.07.2011 | IE | 28.09.2011 | LU | 28.09.2011 | CH | 30.09.2011 | LI | 30.09.2011 | MC | 30.09.2011 | [2013/25] |
Former [2012/35] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
DK | 09.03.2011 | ||
FI | 09.03.2011 | ||
IT | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
IE | 28.09.2011 | ||
CH | 30.09.2011 | ||
LI | 30.09.2011 | ||
MC | 30.09.2011 | ||
Former [2012/33] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
DK | 09.03.2011 | ||
FI | 09.03.2011 | ||
IT | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
CH | 30.09.2011 | ||
LI | 30.09.2011 | ||
MC | 30.09.2011 | ||
Former [2012/23] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
DK | 09.03.2011 | ||
FI | 09.03.2011 | ||
IT | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
MC | 30.09.2011 | ||
Former [2012/20] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
DK | 09.03.2011 | ||
FI | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
MC | 30.09.2011 | ||
Former [2012/10] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
DK | 09.03.2011 | ||
FI | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
Former [2011/47] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
FI | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
PT | 11.07.2011 | ||
Former [2011/41] | AT | 09.03.2011 | |
BE | 09.03.2011 | ||
CY | 09.03.2011 | ||
FI | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
Former [2011/39] | AT | 09.03.2011 | |
CY | 09.03.2011 | ||
FI | 09.03.2011 | ||
NL | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
Former [2011/37] | CY | 09.03.2011 | |
FI | 09.03.2011 | ||
SE | 09.03.2011 | ||
GR | 10.06.2011 | ||
ES | 20.06.2011 | ||
Former [2011/36] | SE | 09.03.2011 | |
GR | 10.06.2011 | ||
ES | 20.06.2011 | Cited in | International search | [X]US5273939 (BECKER ROLF [DE], et al) [X] 16,19,20 * column 4, line 64 - column 5, line 12; figures 3A-3D *; | [XA]US5578843 (GARABEDIAN RAFFI M [US], et al) [X] 1,2,8,16 * column 5 - column 8; figures 1I,3B,10A * * column 13 * [A] 10; | [A]US5650568 (GREIFF PAUL [US], et al) [A] * cited by the applicant; column 3, line 50 - line 65; figure 17 ** column 18, line 32 - line 65 *; | [XA]EP0820104 (HUGHES AIRCRAFT CO [US]) [X] 1,7,8 * column 8, line 33 - line 54; figure 5 * [A] 10 | Examination | - SCHRODER, SEMICONDUCTOR MATERIAL AND DEVICE CHARACTERIZATION, USA, WILEY, pages 203 - 207 | by applicant | US5650568 |