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EP1341231
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EP About this file: EP1341231
| EP1341231 - System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 20.10.2006 Database last updated on 26.07.2024 | Most recent event Tooltip | 20.10.2006 | Withdrawal of application | published on 22.11.2006 [2006/47] | Applicant(s) | For all designated states STMicroelectronics, Inc. 1310 Electronics Drive Carrollton Texas 75006-5039 / US | [N/P] |
| Former [2003/36] | For all designated states STMicroelectronics, Inc. 1310 Electronics Drive Carrollton Texas 75006-5039 / US | Inventor(s) | 01 /
Chiu, Anthony M. 2563 Buttercup Drive Richardson, Texas 75082 / US | 02 /
Siegel, Harry Michael 825 Wheelwood Drive Hurst, Texas 76053 / US | [2003/36] | Representative(s) | Style, Kelda Camilla Karen, et al Page White & Farrer Limited Bedford House 21A John Street London WC1N 2BF / GB | [N/P] |
| Former [2003/36] | Style, Kelda Camilla Karen, et al Page White & Farrer, 54 Doughty Street London WC1N 2LS / GB | Application number, filing date | 03250539.8 | 29.01.2003 | [2003/36] | Priority number, date | US20020066422 | 31.01.2002 Original published format: US 66422 | [2003/36] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1341231 | Date: | 03.09.2003 | Language: | EN | [2003/36] | Type: | A3 Search report | No.: | EP1341231 | Date: | 19.07.2006 | [2006/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 16.06.2006 | Classification | IPC: | H01L21/48 | [2006/29] | CPC: |
H01L21/481 (EP,US);
H01L21/4857 (EP,US);
H05K3/4655 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/48237 (EP,US);
H01L2224/73265 (EP,US);
H05K2201/0195 (EP,US);
H05K2201/09781 (EP,US);
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US)
|
| Former IPC [2003/36] | H01L23/522, H01L21/768, H01L21/3105 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, SE, SI, SK, TR [2003/36] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | Title | German: | Verfahren und Vorrichtung zum mechanischen Planarisieren von gestapelten Schichten in einem integrierten Schaltungsgehäuse | [2003/36] | English: | System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package | [2003/36] | French: | Système et méthode de planarisation mechanique d'une superposition de couches dans un boîtier de circuit intégré | [2003/36] | Examination procedure | 10.10.2006 | Application withdrawn by applicant [2006/47] | Fees paid | Renewal fee | 04.11.2004 | Renewal fee patent year 03 | 12.01.2006 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JPH02290095 ; | [X]JPS63240045 ; | [X]JPH0766552 (HITACHI LTD) [X] 1-18 * paragraphs [0001] - [0011] * * figure 4 *; | [X]JPH10256707 (NGK SPARK PLUG CO) [X] 1-8 * paragraph [0015] * * paragraphs [0022] - [0028] - [0039] * * figures 5,6,7E *; | [A]JP2000332387 (NODA SCREEN KK) [A] 1-3,5,6,9,13 * the whole document *; | [A]US2002005249 (KUWAKO FUJIO [JP], et al) [A] 1,5,9,13,18 * paragraphs [0031] - [0033] * * paragraphs [0049] , [0050] ** figure 2 * | [X] - PATENT ABSTRACTS OF JAPAN, (19910215), vol. 015, no. 066, Database accession no. (E - 1034), & JP02290095 A 19901129 (MATSUSHITA ELECTRIC WORKS LTD) [X] 1-4 * abstract * * figures 1-4 * | [X] - PATENT ABSTRACTS OF JAPAN, (19890202), vol. 013, no. 046, Database accession no. (E - 711), & JP63240045 A 19881005 (MATSUSHITA ELECTRIC IND CO LTD) [X] 1-4 * abstract * * figures 1-7 * |