Extract from the Register of European Patents

EP About this file: EP2907159

EP2907159 - EMBEDDING THIN CHIPS IN POLYMER [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  26.03.2021
Database last updated on 08.04.2026
FormerExamination is in progress
Status updated on  18.06.2019
FormerRequest for examination was made
Status updated on  10.01.2017
Most recent event   Tooltip26.03.2021Application deemed to be withdrawnpublished on 28.04.2021  [2021/17]
Applicant(s)For all designated states
MC10 Inc.
10 Maguire Road, Building 3
1st Floor
Lexington, Massachusetts 02421 / US
[2020/22]
Former [2015/34]For all designated states
MC10 Inc.
9 Camp Street
2nd Floor
Cambridge, MA 02140 / US
Inventor(s)01 / RAFFERTY, Conor
133 Carlisle Street
Newton, MA 02459 / US
02 / DALAL, Mitul
16 Aspen Ave.
South Grafton, MA 01560 / US
 [2015/34]
Representative(s)Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
[N/P]
Former [2015/34]Carter, Stephen John, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
Application number, filing date13845644.709.10.2013
[2015/34]
WO2013US64152
Priority number, dateUS201261711629P09.10.2012         Original published format: US 201261711629 P
US20131384463815.03.2013         Original published format: US201313844638
[2015/34]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2014059032
Date:17.04.2014
Language:EN
[2014/16]
Type: A1 Application with search report 
No.:EP2907159
Date:19.08.2015
Language:EN
The application published by WIPO in one of the EPO official languages on 17.04.2014 takes the place of the publication of the European patent application.
[2015/34]
Search report(s)International search report - published on:US17.04.2014
(Supplementary) European search report - dispatched on:EP03.05.2016
ClassificationIPC:H01L23/13, H01L23/16
[2016/22]
CPC:
H10W70/688 (EP,US); H05K1/189 (EP,US); H10P72/7402 (EP,US);
H10W70/614 (EP,US); H10W70/635 (EP,US); H10W70/685 (EP,US);
H10W72/90 (US); H10W74/01 (EP,US); H10W74/111 (US);
H10W74/114 (EP,US); H10W76/40 (EP,US); H05K1/0283 (EP,US);
H05K1/185 (EP,US); H05K2203/1469 (EP,US); H10P72/7416 (EP,US);
H10P72/744 (EP,US); H10W70/093 (EP,US); H10W70/099 (EP,US);
H10W70/655 (EP,US); H10W70/682 (EP,US); H10W72/01936 (EP,US);
H10W72/01951 (EP,US); H10W72/073 (EP,US); H10W72/07323 (EP,US);
H10W72/07327 (EP,US); H10W72/074 (EP,US); H10W72/29 (EP,US);
H10W72/325 (EP,US); H10W72/352 (EP,US); H10W72/354 (EP,US);
H10W72/874 (EP,US); H10W72/922 (EP,US); H10W72/923 (EP,US);
H10W72/9413 (EP,US); H10W72/952 (EP,US); H10W90/734 (EP,US);
H10W90/736 (EP,US) (-)
Former IPC [2015/34]H01L23/13
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/34]
TitleGerman:EINBETTUNG VON DÜNNCHIPS IN POLYMER[2015/34]
English:EMBEDDING THIN CHIPS IN POLYMER[2015/34]
French:ENCASTREMENT DE PUCES MINCES DANS UN POLYMÈRE[2015/34]
Entry into regional phase28.04.2015National basic fee paid 
28.04.2015Search fee paid 
28.04.2015Designation fee(s) paid 
28.04.2015Examination fee paid 
Examination procedure28.04.2015Examination requested  [2015/34]
21.03.2017Amendment by applicant (claims and/or description)
24.06.2019Invitation to indicate the basis for amendments (Time limit: M01)
05.08.2019Reply to an invitation to indicate the basis for amendments
15.05.2020Despatch of a communication from the examining division (Time limit: M06)
26.11.2020Application deemed to be withdrawn, date of legal effect  [2021/17]
16.12.2020Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2021/17]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  15.05.2020
Request for further processing for:The application is deemed to be withdrawn due to failure to reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report/Supplementary European search report
21.03.2017Request for further processing filed
21.03.2017Full payment received (date of receipt of payment)
Request granted
03.04.2017Decision despatched
Fees paidRenewal fee
27.10.2015Renewal fee patent year 03
21.10.2016Renewal fee patent year 04
25.10.2017Renewal fee patent year 05
24.10.2018Renewal fee patent year 06
25.10.2019Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.10.202008   M06   Not yet paid
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Documents cited:Search[X] US2002079572  (KHAN REZA-UR RAHMAN et al.) [X] 1,2,4,6-8,14,19-25,29 * paragraphs [0059] , [0 63] , [ 151]; figures 9A, 9B *
 [A] WO0247162  (INTEL CORP et al.) [A] 1-29 * figures 15-17 *
International search[X] US2012091594  (LANDESBERGER CHRISTOF et al.) [X]
 [Y] US2011051384  (KRIECHBAUM ARNO et al.) [Y]
 [Y] US2005067293  (NAITO TOSHIKI et al.) [Y]
 [Y] US2010002402  (ROGERS JOHN A et al.) [Y]
 [Y] US2012074546  (CHONG CHOOI MEI et al.) [Y]
 [Y] US2008211087  (MUELLER-HIPPER ANDREAS et al.) [Y]
 [Y] US2008237840  (ALCOE DAVID J et al.) [Y]
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.