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Extract from the Register of European Patents

EP About this file: EP3358603

EP3358603 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  10.07.2020
Database last updated on 24.04.2024
FormerRequest for examination was made
Status updated on  06.07.2018
FormerThe international publication has been made
Status updated on  08.04.2017
Most recent event   Tooltip10.07.2020Application deemed to be withdrawnpublished on 12.08.2020  [2020/33]
Applicant(s)For all designated states
Renesas Electronics Corporation
2-24, Toyosu 3-chome
Koutou-ku
Tokyo 135-0061 / JP
[2018/32]
Inventor(s)01 / MATSUMOTO, Masahiro
c/o Renesas Semiconductor Manufacturing Co., Ltd.
751 Horiguchi
Hitachinaka-shi Ibaraki 312-8504 / JP
02 / ICHINOSE, Kazuhito
c/o Renesas Semiconductor Manufacturing Co., Ltd.
751 Horiguchi
Hitachinaka-shi Ibaraki 312-8504 / JP
03 / YAJIMA, Akira
c/o Renesas Semiconductor Manufacturing Co., Ltd.
751 Horiguchi
Hitachinaka-shi Ibaraki 312-8504 / JP
 [2018/32]
Representative(s)Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
[N/P]
Former [2018/32]Moore, Graeme Patrick, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
Application number, filing date15905451.901.10.2015
[2018/32]
WO2015JP77970
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017056297
Date:06.04.2017
Language:JA
[2017/14]
Type: A1 Application with search report 
No.:EP3358603
Date:08.08.2018
Language:EN
[2018/32]
Search report(s)International search report - published on:JP06.04.2017
(Supplementary) European search report - dispatched on:EP10.05.2019
ClassificationIPC:H01L21/3205, H01L21/768, H01L23/522, H01L23/00
[2019/24]
CPC:
H01L24/06 (EP); H01L21/3205 (KR,US); H01L21/768 (KR,US);
H01L23/522 (EP,KR,US); H01L2224/02166 (EP); H01L2224/02311 (EP,US);
H01L2224/02331 (EP,US); H01L2224/02377 (EP,US); H01L2224/0346 (EP,US);
H01L2224/0347 (EP,US); H01L2224/0391 (EP,US); H01L2224/0401 (EP,US);
H01L2224/04042 (EP,US); H01L2224/05 (KR,US); H01L2224/05008 (EP,US);
H01L2224/05018 (EP,US); H01L2224/05024 (EP,US); H01L2224/05124 (EP);
H01L2224/05139 (EP); H01L2224/05144 (EP); H01L2224/05147 (EP);
H01L2224/05155 (EP); H01L2224/05164 (EP); H01L2224/05166 (EP);
H01L2224/05171 (EP); H01L2224/05181 (EP); H01L2224/05186 (EP);
H01L2224/05567 (EP); H01L2224/05582 (EP,US); H01L2224/05639 (EP);
H01L2224/05644 (EP); H01L2224/05647 (EP); H01L2224/05664 (EP);
H01L2224/06131 (EP,US); H01L2224/131 (EP); H01L2224/32225 (EP);
H01L2224/45099 (EP); H01L2224/48091 (EP,KR,US); H01L2224/48227 (EP);
H01L2224/48465 (EP,KR,US); H01L2224/73265 (EP,KR,US); H01L2224/814 (EP);
H01L2224/854 (EP); H01L23/3157 (EP,US); H01L23/562 (EP,US);
H01L23/564 (EP,US); H01L24/03 (EP,US); H01L24/05 (EP,US);
H01L2924/181 (EP,KR,US); H01L2924/3511 (EP) (-)
C-Set:
H01L2224/05124, H01L2924/00014 (EP);
H01L2224/05139, H01L2924/00014 (EP);
H01L2224/05144, H01L2924/00014 (EP);
H01L2224/05147, H01L2924/00014 (EP);
H01L2224/05155, H01L2924/00014 (EP);
H01L2224/05164, H01L2924/00014 (EP);
H01L2224/05166, H01L2924/00014 (EP);
H01L2224/05171, H01L2924/00014 (EP);
H01L2224/05181, H01L2924/00014 (EP);
H01L2224/05186, H01L2924/04941, H01L2924/00014 (EP);
H01L2224/05639, H01L2924/00014 (EP);
H01L2224/05644, H01L2924/013, H01L2924/00014 (EP);
H01L2224/05647, H01L2924/00014 (EP);
H01L2224/05664, H01L2924/013, H01L2924/00014 (EP);
H01L2224/131, H01L2924/014, H01L2924/00014 (EP);
H01L2224/45099, H01L2924/00014 (EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP);
H01L2224/814, H01L2924/00014 (EP);
H01L2224/854, H01L2924/00014 (EP);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Former IPC [2018/32]H01L21/3205, H01L21/768, H01L23/522
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/32]
TitleGerman:HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON[2018/32]
English:SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME[2018/32]
French:DISPOSITIF À SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION[2018/32]
Entry into regional phase14.03.2018Translation filed 
21.03.2018National basic fee paid 
21.03.2018Search fee paid 
21.03.2018Designation fee(s) paid 
21.03.2018Examination fee paid 
Examination procedure14.03.2018Date on which the examining division has become responsible
21.03.2018Examination requested  [2018/32]
09.11.2018Amendment by applicant (claims and/or description)
10.12.2019Application deemed to be withdrawn, date of legal effect  [2020/33]
17.01.2020Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2020/33]
Fees paidRenewal fee
21.03.2018Renewal fee patent year 03
25.10.2018Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
31.10.201905   M06   Not yet paid
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Documents cited:Search[XYI]US2012074534  (LIN YAOJIAN [SG], et al) [X] 1-3,6,7,11,13-15 * paragraphs [0008] , [00 9] , [0 40] - [0060]; figures 5c, 7a, 8a, 9 * [Y] 4,5 [I] 9,10,12;
 [Y]US2013181329  (WADA HAJIME [JP]) [Y] 5* figure 14 *;
 [XYI]US2015228587  (CHENG JUNG WEI [TW], et al) [X] 1,3,6-9,11,13,15 * paragraphs [0017] - [0029] - [0 42]; figures 1-5, 11 * [Y] 4,5 [I] 10,12;
 [Y]US2015255420  (SAITO KENTARO [JP]) [Y] 4 * paragraphs [0059] - [0071]; figures 9-11 *
International search[Y]JP2010192867  (RENESAS ELECTRONICS CORP) [Y] 1-28 * , paragraphs [0014] to [0144] & US 2010/0181650 A1 paragraphs [0055] to [0190] & TW 201030915 A *;
 [A]JP2010278040  (RENESAS ELECTRONICS CORP) [A] 1-28 * , & US 2010/0301459 A1 *;
 [A]JP2013058584  (RENESAS ELECTRONICS CORP) [A] 1-28* , & US 2013/0062777 A1 *;
 [Y]JP2014165403  (RENESAS ELECTRONICS CORP) [Y] 1-28 * , paragraphs [0012] to [0207] & US 2015/0162284 A1 paragraphs [0050] to [0238] & CN 104009024 A & TW 201442165 A *;
 [Y]JP2015170778  (RENESAS ELECTRONICS CORP) [Y] 1-28 * , paragraphs [0034] to [0091] (Family: none) *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.