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Extract from the Register of European Patents

EP About this file: EP0304632

EP0304632 - A contacless technique for semiconductor wafer testing [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  10.10.1997
Database last updated on 17.05.2024
Most recent event   Tooltip10.10.1997Application deemed to be withdrawnpublished on 26.11.1997 [1997/48]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1989/09]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Curtis, Huntington Woodman
Box 18
Chelsea New York 12512 / US
02 / Fung, Min-Su
Route No. 1, Barmore Road
LaGrangeville, N.Y. 12540 / US
03 / Verkuil, Roger Leonard
37, sherwood Heights
Wappingers Falls, N.Y. 12590 / US
[1989/09]
Representative(s)Schuffenecker, Thierry, et al
Compagnie IBM France
Département de Propriété Intellectuelle
06610 La Gaude / FR
[N/P]
Former [1996/20]Schuffenecker, Thierry, et al
Compagnie IBM France, Département de Propriété Intellectuelle
F-06610 La Gaude / FR
Former [1989/09]Bonin, Jean-Jacques
Compagnie IBM France Département de Propriété Intellectuelle
F-06610 La Gaude / FR
Application number, filing date88111849.122.07.1988
[1989/09]
Priority number, dateUS1987008964826.08.1987         Original published format: US 89648
[1989/09]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0304632
Date:01.03.1989
Language:EN
[1989/09]
Type: A3 Search report 
No.:EP0304632
Date:27.03.1991
Language:EN
[1991/13]
Search report(s)(Supplementary) European search report - dispatched on:EP04.02.1991
ClassificationIPC:G01R31/302, G01R31/26, G01R5/28, H01L21/66
[1991/09]
CPC:
G01R31/2831 (EP,US); G01R15/165 (EP,US)
Former IPC [1989/09]G01R31/26, H01L21/66
Designated contracting statesDE,   FR,   GB [1989/09]
TitleGerman:Kontaktlose Technik zum Prüfen von Halbleiter-Scheiben[1989/09]
English:A contacless technique for semiconductor wafer testing[1989/09]
French:Technique sans contact pour l'essai d'une tranche semi-conducteur[1989/09]
Examination procedure19.06.1989Examination requested  [1989/33]
09.10.1992Despatch of a communication from the examining division (Time limit: M06)
16.04.1993Reply to a communication from the examining division
02.06.1993Despatch of a communication from the examining division (Time limit: M06)
07.04.1994Reply to a communication from the examining division
23.09.1994Despatch of a communication from the examining division (Time limit: M06)
03.04.1995Reply to a communication from the examining division
13.12.1995Despatch of communication of intention to grant (Approval: Yes)
04.04.1996Communication of intention to grant the patent
23.04.1996Fee for grant paid
23.04.1996Fee for publishing/printing paid
02.01.1997Application deemed to be withdrawn, date of legal effect  [1997/48]
28.02.1997Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [1997/48]
Request for further processing for:07.04.1994Request for further processing filed
07.04.1994Full payment received (date of receipt of payment)
Request granted
14.06.1994Decision despatched
Request for re-establishment of rights:07.04.1994Date of receipt
14.06.1994Request accepted
Fees paidRenewal fee
23.07.1990Renewal fee patent year 03
13.12.1990Renewal fee patent year 04
25.07.1992Renewal fee patent year 05
16.07.1993Renewal fee patent year 06
18.07.1994Renewal fee patent year 07
14.07.1995Renewal fee patent year 08
Penalty fee
Additional fee for renewal fee
31.07.199609   M06   Not yet paid
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Documents cited:Search[Y]US4326165  (SZEDON JOHN R)
 [Y]  - RADIO FERNSEHEN ELEKTRONIK. vol. 32, no. 2, February 1983, BERLIN DD pages 105 - 109; H.Eisenblätter et.al.: "Messungen des Oberflächenpotentials an hochohmigen Halbleitern und Dielektrika"
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.