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EP0729179
European procedure
Extract from the Register of European Patents
EP About this file: EP0729179
| EP0729179 - Pressure contact housing for semiconductor component [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.05.2001 Database last updated on 11.05.2024 | Most recent event Tooltip | 22.05.2009 | Change - representative | published on 24.06.2009 [2009/26] | Applicant(s) | For all designated states ABB Industrie AG Haselstrasse 16 5400 Baden / CH | [2000/27] |
| Former [2000/23] | For all designated states Asea Brown Boveri AG Haselstrasse 16 5401 Baden / CH | ||
| Former [1997/06] | For all designated states ASEA BROWN BOVERI AG Haselstrasse 16 5401 Baden / CH | ||
| Former [1996/35] | For all designated states ABB Management AG Haselstrasse 16 CH-5401 Baden / CH | Inventor(s) | 01 /
Bolgiani, Fabio Via ai Ronchi 9 CH-6500 Bellinzona / CH | [1996/35] | Representative(s) | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property CH-IP Brown Boveri Strasse 6 5400 Baden / CH | [N/P] |
| Former [2009/26] | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property (CH-LC/IP), Brown Boveri Strasse 6 5400 Baden / CH | ||
| Former [2000/27] | ABB Patent Attorneys c/o ABB Business Services Ltd. (SLE-I) Haselstrasse 16/699 5401 Baden / CH | Application number, filing date | 96810070.1 | 02.02.1996 | [1996/35] | Priority number, date | DE19951005387 | 17.02.1995 Original published format: DE 19505387 | [1996/35] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0729179 | Date: | 28.08.1996 | Language: | DE | [1996/35] | Type: | B1 Patent specification | No.: | EP0729179 | Date: | 05.07.2000 | Language: | DE | [2000/27] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.05.1996 | Classification | IPC: | H01L23/051 | [1996/35] | CPC: |
H01L24/72 (EP,US);
H01L23/051 (EP,KR,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01068 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/30107 (EP,US)
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| Designated contracting states | DE, FR, GB, IT, NL [1996/35] | Title | German: | Druckkontaktgehäuse für Halbleiterbauelemente | [1996/35] | English: | Pressure contact housing for semiconductor component | [1996/35] | French: | Boîtier de contact par pression pour composant semi-conducteur | [1996/35] | Examination procedure | 13.02.1997 | Examination requested [1997/15] | 09.04.1998 | Despatch of a communication from the examining division (Time limit: M04) | 05.08.1998 | Reply to a communication from the examining division | 14.04.1999 | Despatch of a communication from the examining division (Time limit: M02) | 09.06.1999 | Reply to a communication from the examining division | 28.07.1999 | Despatch of communication of intention to grant (Approval: Yes) | 18.08.1999 | Communication of intention to grant the patent | 16.10.1999 | Fee for grant paid | 16.10.1999 | Fee for publishing/printing paid | Opposition(s) | 06.04.2001 | No opposition filed within time limit [2001/25] | Fees paid | Renewal fee | 21.02.1998 | Renewal fee patent year 03 | 19.01.1999 | Renewal fee patent year 04 | 14.01.2000 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4092703 (SUEOKA TETSURO, et al) [A] 1 * figures 16,17; claim 1 *; | [A]EP0159797 (MITSUBISHI ELECTRIC CORP [JP]) [A] 1 * figures 7,8 *; | [A]CH582425 (WESTINGHOUSE ELECTRIC CORP) [A] 1 * figures 1,2 * |